Display device

ABSTRACT

An organic light emitting diode display device includes a first driving voltage line including a first portion extending in a first direction and a second portion having a larger width than the first portion in a second direction perpendicular to the first direction. The second portion overlaps a gate electrode of a driving thin film transistor, an interlayer insulating layer is between the second portion and the gate electrode of the driving thin film transistor.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a continuation application of U.S. patentapplication Ser. No. 16/274,728, filed Feb. 13, 2019 (now pending), thedisclosure of which is herein incorporated by reference in its entirety.U.S. patent application Ser. No. 16/274,728 is a continuationapplication of U.S. patent application Ser. No. 15/944,930 filed Apr. 4,2018, now U.S. Pat. No. 10,230,074 issued Mar. 12, 2019, the disclosureof which is herein incorporated by reference in its entirety. U.S.patent application Ser. No. 15/944,930 is a continuation application ofU.S. patent application Ser. No. 14/840,686 filed Aug. 31, 2015, nowU.S. Pat. No. 9,941,489 issued Apr. 10, 2018, the disclosure of which isherein incorporated by reference in its entirety. U.S. Pat. No.9,941,489 claims priority benefit of Korean Patent Application No.10-2014-0115653, filed on Sep. 1, 2014 and Korean Patent Application No.10-2015-0119646, filed on Aug. 25, 2015 in the Korean IntellectualProperty Office, the disclosures of which are incorporated herein byreference for all purposes.

BACKGROUND 1. Field

One or more embodiments described herein relate to an organic lightemitting diode display device and a manufacturing method of an organiclight emitting diode display device.

2. Description of the Related Art

An organic light emitting display generates images using a plurality ofpixels. Each pixel includes an organic light emitting diode, and eachdiode is formed from an organic emission layer between two electrodes.Electron from one electrode and holes from the other electrode arecoupled in the organic emission layer to generate excitons. Light isemitted when the excitons change state.

Each pixel uses thin film transistors and capacitors to drive theorganic light emitting diode. The transistors include a switchingtransistor and a driving transistor. In order to form the transistorsand capacitors and the organic light emitting layer in each pixel, aplurality of masks are used. The cost of each mask is very expensive.

SUMMARY

In accordance with one or more embodiments, an organic light emittingdiode display device, comprising a substrate, a semiconductor of aswitching thin film transistor on the substrate; a semiconductor of adriving thin film transistor on the substrate and having one or morebent portions; a gate insulating layer covering the semiconductor of theswitching thin film transistor and the semiconductor of the driving thinfilm transistor; a gate electrode of the switching thin film transistoron the gate insulating layer and overlapping the semiconductor of theswitching thin film transistor; a gate electrode of the driving thinfilm transistor on the gate insulating layer and overlapping thesemiconductor of the driving thin film transistor; an interlayerinsulating layer covering the gate electrode of the switching thin filmtransistor and the gate electrode of the driving thin film transistor; adata line on the interlayer insulating layer and electrically connectedto the semiconductor of the switching thin film transistor; and a firstdriving voltage line on the interlayer insulating layer, wherein thefirst driving voltage line includes a first portion extending in a firstdirection and a second portion having a larger width than the firstportion in a second direction perpendicular to the first direction, andwherein the second portion overlaps the gate electrode of the drivingthin film transistor with the interlayer insulating layer interposedbetween the second portion and the second gate electrode.

The display device may include a second driving voltage line in adifferent layer from the first driving voltage line and electricallyconnected to the first driving voltage line, wherein the second drivingvoltage line includes a portion substantially extending in the seconddirection. The second driving voltage line may be in a different layerfrom the data line. The second driving voltage line may be electricallyconnects two or more adjacent ones of the first driving voltage line toeach other. The second driving voltage line may include a portionextending substantially in a direction crossing the first direction. Thesecond driving voltage line may be in a same layer as the gate electrodeof the driving thin film transistor, and may include a same material asthe gate electrode of the driving thin film transistor.

The gate electrode of the driving thin film transistor may have aportion not overlapping the second portion of the first driving voltageline, and the interlayer insulating layer may include a contact holedisposed on the portion of the gate electrode of the driving thin filmtransistor not overlapping the second portion. The second drivingvoltage line may be in a same layer as a semiconductor of the drivingthin film transistor and may include a same material as thesemiconductor of the driving thin film transistor.

The second driving voltage line may include an expansion covering atleast one of two adjacent ones of the data line and extending along thedata line. Two adjacent ones of the second portion of the first drivingvoltage line may be connected to each other. The display device mayinclude an insulating layer on the interlayer insulating layer, the dataline, and the first driving voltage line.

The display device may include a pixel electrode on the insulatinglayer; an organic emission layer on the pixel electrode; and a commonelectrode on the organic emission layer, wherein the second drivingvoltage line is in a same layer as the pixel electrode and includes asame material as the pixel electrode. The semiconductor of the switchingthin film transistor may be integrally formed with the semiconductor ofthe driving thin film transistor. The display device may include a scanline connected to the gate electrode of the switching thin filmtransistor, wherein the scan line is in a same layer as the gateelectrode of the driving thin film transistor.

Only the interlayer insulating layer may be interposed between thesecond portion of the first driving voltage line and the gate electrodeof the driving thin film transistor. Any other conductive layer may notbe interposed between the second portion of the first driving voltageline and the gate electrode of the driving thin film transistor.

In accordance with one or more other embodiments, an organic lightemitting diode display device comprises a substrate; a scan line, on thesubstrate, to transfer a scan signal; a data line to transfer a datavoltage and a first driving voltage line to transfer a driving voltage,the first driving voltage line including a first portion extending in adirection crossing the scan line which extends in a first direction, anda second portion connected to the first portion; a switching thin filmtransistor including a first gate electrode connected to the scan line,a first source electrode connected to the data line, and a first drainelectrode facing the first source electrode; a driving thin filmtransistor including a second source electrode connected to the firstdrain electrode, a second drain electrode facing the second sourceelectrode, a second gate electrode, and a semiconductor; a storagecapacitor including the second gate electrode of the driving thin filmtransistor as a first storage terminal and including the second portionof the first driving voltage line as a second storage terminal; and anorganic light emitting diode electrically connected to the second drainelectrode of the driving thin film transistor.

The second portion of the first driving voltage line may have a largerwidth than the first portion in a second direction perpendicular to thefirst direction. The display device may include a second driving voltageline positioned in a different layer from the first driving voltage lineand electrically connected to the first driving voltage line, whereinthe second driving voltage line includes a portion extendingsubstantially in a direction crossing the first direction.

The second driving voltage line may be between the first driving voltageline and the substrate. The second driving voltage line may be in a samelayer as the scan line. The second driving voltage line may be in a samelayer as the semiconductor of the driving thin film transistor and mayincludes a same material as the semiconductor of the driving thin filmtransistor. The second driving voltage line may include an expansioncovering at least one of two adjacent ones of the data line andextending along the data line.

The display device may include a planarization layer covering theswitching thin film transistor, the driving thin film transistor, thestorage capacitor, and the first driving voltage line. The organic lightemitting diode may include a pixel electrode, an organic emission layer,and a common electrode disposed on the planarization layer, and thesecond driving voltage line is to transfer the driving voltage through acontact hole in the planarization layer. The second driving voltage linemay be between the first driving voltage line and the organic emissionlayer. The second driving voltage line may be in a same layer as thepixel electrode with a same material. The second driving voltage linemay electrically connect two or more adjacent ones of the first drivingvoltage line with each other. Two adjacent ones of the second portion ofthe first driving voltage line may be connected to each other.

In accordance with one or more other embodiments, a method formanufacturing an organic light emitting diode display device includesforming a driving semiconductor and a switching semiconductor on asubstrate; forming a gate insulating layer on the driving semiconductorand the switching semiconductor; forming a driving gate electrode and aswitching gate electrode on the gate insulating layer and correspondingto a channel region of the driving semiconductor and a channel region ofthe switching semiconductor, respectively; forming an interlayerinsulating layer covering the driving gate electrode and the switchinggate electrode; and forming a data line and a first driving voltage lineincluding a first portion substantially extending in a first directionand a second portion which is wider than the first portion in a seconddirection perpendicular to the first direction, on the interlayerinsulating layer, forming a second driving voltage line in a differentlayer from the first driving voltage line and electrically connected thefirst driving voltage line, the second driving voltage line including aportion substantially extending in the second direction, wherein thesecond portion of the first driving voltage line overlaps the drivinggate electrode.

Forming the switching gate electrode may include forming a scan lineconnected to the switching gate electrode, the scan line to transfer ascan signal. The driving semiconductor layer may include a plurality ofbent portions. Forming the second driving voltage line and forming thescan line may be simultaneously performed. Forming the second drivingvoltage line and forming the driving semiconductor may be simultaneouslyperformed.

The method may include forming a planarization layer covering theinterlayer insulating layer and the first driving voltage line; forminga pixel electrode on the planarization layer; forming an organicemission layer on the pixel electrode; and forming a common electrode onthe organic emission layer, wherein forming the second driving voltageline and forming the pixel electrode are simultaneously performed. Thesecond driving voltage line may electrically connect two or moreadjacent ones of the first driving voltage line with each other.

BRIEF DESCRIPTION OF THE DRAWINGS

Features will become apparent to those of skill in the art by describingin detail exemplary embodiments with reference to the attached drawingsin which:

FIG. 1 illustrates an embodiment of a pixel;

FIG. 2 illustrates an example of control signals for the pixel;

FIG. 3 illustrates a layout embodiment of the pixel;

FIG. 4 illustrates a layout embodiment including three adjacent pixels;

FIG. 5 illustrates a view along section line V-V in FIG. 3;

FIGS. 6 to 11 illustrate stages in one embodiment of manufacturingmethod;

FIG. 12 illustrates another layout embodiment of a pixel;

FIG. 13 illustrates another embodiment of three adjacent pixels;

FIG. 14 illustrates a view along section line XIV-XIV in FIG. 12;

FIG. 15 illustrates another embodiment of a pixel;

FIG. 16 illustrates an example of control signals for the pixel in FIG.15;

FIG. 17 illustrates another layout embodiment of a pixel;

FIG. 18 illustrates another layout embodiment of three adjacent pixels;

FIG. 19 illustrates a view along section line XIX-XIX in FIG. 17;

FIG. 20 illustrates another layout embodiment of a pixel;

FIG. 21 illustrates another layout embodiment of three adjacent pixels;

FIG. 22 illustrates a view along section line XXII-XXII in FIG. 20; and

FIGS. 23 to 28 illustrate a layout embodiment of two adjacent pixels.

DETAILED DESCRIPTION

Example embodiments will now be described more fully hereinafter withreference to the accompanying drawings; however, they may be embodied indifferent forms and should not be construed as limited to theembodiments set forth herein. Rather, these embodiments are provided sothat this disclosure will be thorough and complete, and will fullyconvey exemplary implementations to those skilled in the art. Theembodiments may be combined to form additional embodiments.

It will also be understood that when a layer or element is referred toas being “on” another layer or substrate, it can be directly on theother layer or substrate, or intervening layers may also be present.Further, it will be understood that when a layer is referred to as being“under” another layer, it can be directly under, and one or moreintervening layers may also be present. In addition, it will also beunderstood that when a layer is referred to as being “between” twolayers, it can be the only layer between the two layers, or one or moreintervening layers may also be present. Like reference numerals refer tolike elements throughout.

FIG. 1 illustrates an embodiment of a pixel of an organic light emittingdiode display device, and FIG. 2 is a timing diagram illustrating anexample of control signals for the pixel.

As illustrated in FIG. 1, the pixel includes a plurality of signallines, a plurality of thin film transistors connected to the signallines, a storage capacitor Cst, and an organic light emitting diodeOLED. The thin film transistors include a driving thin film transistorT1, a switching thin film transistor T2, a compensation thin filmtransistor T3, an initialization thin film transistor T4, an operationcontrol thin film transistor T5, and an emission control thin filmtransistor T6.

The signal lines include a scan line 121 transferring a scan signal Sn,a previous scan line 122 transferring a previous scan signal Sn−1 to theinitialization thin film transistor T4, an emission control line 123transferring an emission control signal Em to the operation control thinfilm transistor T5 and the emission control thin film transistor T6, adata line 171 crossing the scan line 121 and transferring a data signalDm, driving voltage lines 126/172 transferring a driving voltage ELVDD,and an initialization voltage line 124 transferring an initializationvoltage Vint initializing the driving thin film transistor T1. Thedriving voltage lines 126/172 include a first driving voltage line 126parallel with the scan line 121 and a second driving voltage line 172parallel with the data line 171, and the first driving voltage line 126and the second driving voltage line 172 are electrically connected toeach other.

A gate electrode G1 of the driving thin film transistor T1 is connectedwith one end Cst1 of the storage capacitor Cst, a source electrode S1 ofthe driving thin film transistor T1 is connected with the drivingvoltage lines 126/172 via the operation control thin film transistor T5,a drain electrode D1 of the driving thin film transistor T1 iselectrically connected with an anode of the organic light emitting diodeOLED via the emission control thin film transistor T6. The driving thinfilm transistor T1 receives the data signal Dm according to a switchingoperation of the switching thin film transistor T2 to supply a drivingcurrent to the organic light emitting diode OLED.

A gate electrode G2 of the switching thin film transistor T2 isconnected with the scan line 121, a source electrode S2 of the switchingthin film transistor T2 is connected with the data line 171, and a drainelectrode D2 of the switching thin film transistor T2 is connected withthe source electrode S1 of the driving thin film transistor T1 andsimultaneously, connected with the driving voltage lines 126/172 via theoperation control thin film transistor T5. The switching thin filmtransistor T2 is turned on according to the scan signal Sn receivedthrough the scan line 121 to perform a switching operation transferringthe data signal Dm transferred to the data line 171 to the sourceelectrode of the driving thin film transistor T1.

A gate electrode G3 of the compensation thin film transistor T3 isconnected with the scan line 121, a source electrode S3 of thecompensation thin film transistor T3 is connected with the drainelectrode D1 of the driving thin film transistor T1 and simultaneously,connected with an anode of the organic light emitting diode OLED via theemission control thin film transistor T6, and a drain electrode D3 ofthe compensation thin film transistor T3 is connected with one end Cst1of the storage capacitor Cst, the drain electrode D4 of theinitialization thin film transistor T4, and the gate electrode G1 of thedriving thin film transistor T1 together. The compensation thin filmtransistor T3 is turned on according to the scan signal Sn receivedthrough the scan line 121 to connect the gate electrode G1 and the drainelectrode D1 of the driving thin film transistor T1 and diode-connectthe driving thin film transistor T1.

A gate electrode G4 of the initialization thin film transistor T4 isconnected with a previous scan line 122, a source electrode S4 of theinitialization thin film transistor T4 is connected with theinitialization voltage line 124, and a drain electrode D4 of theinitialization thin film transistor T4 is simultaneously connected withone end Cst1 of the storage capacitor Cst, the drain electrode D3 of thecompensation thin film transistor T3, and the gate electrode G1 of thedriving thin film transistor T1. The initialization thin film transistorT4 is turned on according to the previous scan signal Sn−1 receivedthrough the previous scan line 122 to transfer the initializationvoltage Vint to the gate electrode G1 of the driving thin filmtransistor T1 and then an initialization operation is performed toinitialize the voltage of the gate electrode G1 of the driving thin filmtransistor T1.

A gate electrode G5 of the operation control thin film transistor T5 isconnected with the emission control line 123, a source electrode S5 ofthe operation control thin film transistor T5 is connected with thedriving voltage lines 126/172, and a drain electrode D5 of the operationcontrol thin film transistor T5 is connected with the source electrodeS1 of the driving thin film transistor T1 and the drain electrode D2 ofthe switching thin film transistor T2.

A gate electrode G6 of the emission control thin film transistor T6 isconnected with the emission control line 123, a source electrode S6 ofthe emission control thin film transistor T6 is connected with the drainelectrode D1 of the driving thin film transistor T1 and the sourceelectrode S3 of the compensation thin film transistor T3, and a drainelectrode D6 of the emission control thin film transistor T6 iselectrically connected with an anode of the organic light emitting diodeOLED. The operation control thin film transistor T5 and emission controlthin film transistor T6 are simultaneously turned on according to theemission control signal Em received through the emission control line123, and the driving voltage ELVDD is transferred to the organic lightemitting diode OLED and thus a driving current flows in the organiclight emitting diode OLED.

The other end Cst2 of the storage capacitor Cst is connected with thedriving voltage lines 126/172, and a cathode of the organic lightemitting diode OLED is connected with the common voltage ELVSS. As aresult, the organic light emitting diode OLED receives the drivingcurrent from the driving thin film transistor T1 to emit light, therebydisplaying an image.

Referring to FIG. 2, in an initializing period, the previous scan signalSn−1 having a low level is supplied through the previous scan line 122.In this case, the emission control signal Em is already applied at a lowlevel through the emission control line 123. Then, the initializationthin film transistor T4 is turned on based on the previous scan signalSn−1 having the low level, the initialization voltage Vint is suppliedfrom the initialization voltage line 124 connected to the gate electrodeof the driving thin film transistor T1 through the initialization thinfilm transistor T4, and the driving thin film transistor T1 isinitialized by the initialization voltage Vint.

Thereafter, in a data programming period, the scan signal Sn having thelow level is supplied through the scan line 121. Then, the switchingthin film transistor T2 and the compensation thin film transistors T3-1and T3-2 are turned on based on the scan signal Sn having the low level.In this case, the driving thin film transistor T1 is diode-connected bythe turned-on compensation thin film transistors T3-1 and T3-2, andbiased in a forward direction.

Then, a compensation voltage Dm+Vth (Vth is a negative (−) value)reduced from the data signal Dm supplied from the data line 171 by athreshold voltage Vth of the driving thin film transistor T1 is appliedto the gate electrode of the driving thin film transistor T1.

The driving voltage ELVDD and the compensation voltage Dm+Vth areapplied to respective ends of the storage capacitor Cst, and a chargecorresponding to a voltage difference between the ends is stored in thestorage capacitor Cst.

Thereafter, in the emission period, the emission control signal Emsupplied from the emission control line 123 is changed from the highlevel to the low level. Then, in the emission period, the operationcontrol thin film transistor T5 and the emission control thin filmtransistor T6 are turned on by the emission control signal Em of the lowlevel.

Then, a driving current is generated according to a voltage differencebetween the voltage of the gate electrode of the driving thin filmtransistor T1 and the driving voltage ELVDD, and a driving current IOLEDis supplied to the organic light emitting diode OLED through theemission control thin film transistor T6. For the emission period, thegate-source electrode voltage Vgs of the driving thin film transistor T1is maintained at ‘(Dm+Vth)−ELVDD’ by the storage capacitor Cst, andaccording to a current-voltage relationship of the driving thin filmtransistor T1, the driving current ld is proportional to the square‘(Dm−ELVDD)2’ of a value obtained by subtracting the threshold voltagefrom the source-gate electrode voltage. Accordingly, the driving currentIOLED is determined regardless of the threshold voltage Vth of thedriving thin film transistor T1.

FIG. 3 illustrates a layout embodiment of the pixel, FIG. 4 illustratesa layout embodiment of three adjacent pixels, and FIG. 5 illustrates across-sectional view taken along section line V-V in FIG. 3.

As illustrated in FIG. 3, the pixel includes a scan line 121, a previousscan line 122, an emission control line 123, and an initializationvoltage line 124 in a row direction and which respectively apply a scansignal Sn, a previous scan signal Sn−1, an emission control signal Em,and an initialization voltage Vint. The pixel also includes a data line171 which crosses the scan line 121, the previous scan line 122, theemission control line 123, and the initialization voltage line 124 andwhich applies a data signal Dm to the pixel.

The pixel also includes driving voltage lines for applying the drivingvoltage ELVDD. The driving voltage lines include a first driving voltageline 126 parallel to the scan line 121 and a second driving voltage line172 parallel to the data line 171. The first driving voltage line 126and the second driving voltage line 172 are electrically connected witheach other. The first driving voltage line 126 electrically connects twoor more of the second driving voltage lines 172 adjacent to each otherin a horizontal direction such that the driving voltage ELVDD istransmitted in the horizontal direction.

The pixel also includes a driving thin film transistor T1, a switchingthin film transistor T2, compensation thin film transistors T3-1 andT3-2, initialization thin film transistors T4-1 and T4-2, an operationcontrol thin film transistor T5, an emission control thin filmtransistor T6, a storage capacitor Cst, and an organic light emittingdiode are formed. Referring to FIG. 3, the compensation thin filmtransistors T3-1 and T3-2 and the initialization thin film transistorsT4-1 and T4-2 may have a dual gate structure, and hereinafter will bedescribed as transistors connected to each other.

Channels of the driving thin film transistor T1, the switching thin filmtransistor T2, the compensation thin film transistors T3-1 and T3-2, theinitialization thin film transistors T4-1 and T4-2, the operationcontrol thin film transistor T5, and the emission control thin filmtransistor T6 are formed within one connected semiconductor 131, and thesemiconductor 131 is formed to be bent in various shapes. Thesemiconductor 131 according to the exemplary embodiment of FIG. 3includes vertical portions that extend in a vertical direction (adirection parallel with the data line 171) at left and right sides basedon a semiconductor 131 a (referred to as a driving semiconductor) of thedriving thin film transistor T1, and two ends of each vertical portionare bent. An additional extended portion which is bent, for example, ina ‘

’ shape is included on the right vertical portion.

The semiconductor 131 a of the driving thin film transistor T1 has areverse ‘

’ shape (a shape in which the ‘

’ shape is symmetrical based on a vertical line or a horizontal linepassing through the center), most of the reverse ‘

’ shape configures the semiconductor 131 a of the driving thin filmtransistor T1, and the source electrode 176 a and the drain electrode177 a of the driving thin film transistor T1 are positioned at portionswhich are adjacent to the vertical portions positioned at the left andright sides, respectively. While the semiconductor 131 a of the drivingthin film transistor T1 has the reverse ‘

’ shape in the exemplary embodiment, the semiconductor 131 a may have adifferent shape in another embodiment and/or may have one or more bentportions.

Further, the semiconductor 131 a of the driving thin film transistor T1includes a plurality of first extensions 31 in a first direction and aplurality of second extensions 32 in a second direction different fromthe first direction, and a bent portion 33 may have a structureconnecting the first extensions 31 and the second extensions 32.

At the left vertical portion connected with the source electrode 176 aof the driving thin film transistor T1, a semiconductor 131 b (referredto as a switching semiconductor) of the switching thin film transistorT2 positioned above and a semiconductor 131 e of the operation controlthin film transistor T5 positioned below are formed. Between thesemiconductor 131 b of the switching thin film transistor T2 and thesemiconductor 131 e of the operation control thin film transistor T5,the drain electrode 177 b of the switching thin film transistor T2 andthe drain electrode 177 e of the operation control thin film transistorT5 are positioned to be connected with the source electrode 176 a of thedriving thin film transistor T1.

The source electrode 176 b of the switching thin film transistor T2 ispositioned above the semiconductor 131 b of the switching thin filmtransistor T2, and the source electrode 176 e of the operation controlthin film transistor T5 is positioned below the semiconductor 131 e ofthe operation control thin film transistor T5.

At the right vertical portion connected with the drain electrode 177 aof the driving thin film transistor T1, semiconductors 131 c-1 and 131c-2 of the compensation thin film transistors T3-1 and T3-2 positionedabove, and a semiconductor 131 f of the emission control thin filmtransistor T6 positioned below are formed. Between the semiconductors131 c-1 and 131 c-2 of the compensation thin film transistors T3-1 andT3-2 and the semiconductor 131 f of the emission control thin filmtransistor T6, a source electrode 176 c-2 of the second compensationthin film transistor T3-2 of the compensation thin film transistors T3-1and T3-2 and a source electrode 176 f of the emission control thin filmtransistor T6 are positioned to be connected with the drain electrode177 a of the driving thin film transistor T1. A structure of thecompensation thin film transistors T3-1 and T3-2 will be described belowin more detail.

The compensation thin film transistors T3-1 and T3-2 include a firstcompensation thin film transistor T3-1 and a second compensation thinfilm transistor T3-2, and the first compensation thin film transistorT3-1 is positioned based on a protrusion of the scan line 121, and thesecond compensation thin film transistor T3-2 is positioned based on aportion where the scan line 121 and the right vertical portion of thesemiconductor 131 are overlapped with each other.

First, the source electrode 176 c-2 of the second compensation thin filmtransistor T3-2 is connected with the source electrode 176 f of theemission control thin film transistor T6 and the drain electrode 177 aof the driving thin film transistor T1, a gate electrode 125 c-2 ispositioned at a portion of the scan line 121 with which the rightvertical portion is overlapped, the semiconductor 131 c-2 is positionedat a portion of the right vertical portion of the semiconductor 131which overlaps the scan line 121, and a drain 177 c-2 is positionedabove the semiconductor 131 c-2 of the right vertical portion of thesemiconductor 131.

The source electrode 176 c-1 of the first compensation thin filmtransistor T3-1 is connected with the drain 177 c-2 of the secondcompensation thin film transistor T3-2, the gate electrode 125 c-1 ispositioned at the protrusion of the scan line 121, the semiconductor 131c-1 is positioned at a portion of the right vertical portion of thesemiconductor 131 which overlaps the protrusion of the scan line 121,and the drain 177 c-1 is positioned at an opposite side to the sourceelectrode 176 c-1 based on the semiconductor 131 c-1. The firstcompensation thin film transistor T3-1 is positioned at a portion whichis additionally extended in a ‘

’ shape from the right vertical portion of the semiconductor 131.

The drain electrode 177 f of the emission control thin film transistorT6 is positioned below the semiconductor 131 f of the emission controlthin film transistor T6. Semiconductors 131 d-1 and 131 d-2 of theinitialization thin film transistors T4-1 and T4-2 are further formed atthe ‘

’-shaped additional extension which is additionally extended above thesemiconductor 131 c-2 and the drain electrode 177 c-1 of the secondcompensation thin film transistor T3-2. Between the semiconductor 131d-1 of the first initialization thin film transistor T4-1 and the drainelectrode 177 c-1 of the first compensation thin film transistor T3-1,the drain electrode 177 d-1 of the first initialization thin filmtransistor T4-1 is positioned, and the source electrode 176 d-2 of thesecond initialization thin film transistor T4-2 is positioned at an endof the ‘

’-shaped portion which is additionally extended. A structure of theinitialization thin film transistors T4-1 and T4-2 will be describedbelow in more detail.

The initialization thin film transistors T4-1 and T4-2 include a firstinitialization thin film transistor T4-1 and a second initializationthin film transistor T4-2, and the first initialization thin filmtransistor T4-1 is positioned based on a protrusion of the previous scanline 122, and the second initialization thin film transistor T4-2 ispositioned based on a portion where the previous scan line 122 and the ‘

’-shaped portion of the semiconductor 131 are overlapped with eachother.

First, the source electrode 176 d-1 of the first initialization thinfilm transistor T4-1 is connected with the drain electrode 177 c-1 ofthe first compensation thin film transistor T3-1, the gate electrode 125d-1 is positioned at the portion of the previous scan line 122 withwhich the ‘

’-shaped portion of the semiconductor 131 is overlapped, thesemiconductor 131 d-1 is positioned at a portion of the ‘

’-shaped portion of the semiconductor 131 which overlaps the protrusionof the previous scan line 122, and the drain 177 d-1 is positioned at anopposite side to the source electrode 176 d-1 based on the semiconductor131 d-1.

The source electrode 176 d-2 of the second initialization thin filmtransistor T4-2 is connected with the drain 177 d-1 of the firstinitialization thin film transistor T4-1, the gate electrode 125 d-2 ispositioned at the portion of the previous scan line 122 with which the ‘

’-shaped portion of the semiconductor 131 is overlapped, thesemiconductor 131 d-2 is positioned at a portion of the ‘

’-shaped portion of the semiconductor 131 which overlaps the previousscan line 122, and the drain 177 d-2 is positioned at an end of the ‘

’-shaped portion of the semiconductor 131, as an opposite side to thesource electrode 176 d-2 based on the semiconductor 131 d-2.

The semiconductor 131 may have a different structure in anotherembodiment.

The semiconductor 131 may be formed, for example, to include apolycrystalline semiconductor material. The source electrode/drainelectrodes in the semiconductor 131 may be formed by doping only thecorresponding region. Further, in the semiconductor 131, a regionbetween a source electrode and a drain electrode of differenttransistors is doped. Thus, the source electrode and the drain electrodemay be electrically connected to each other.

The semiconductor 131 is formed on an insulation substrate 110, and abuffer layer 111 may be positioned between the insulation substrate 110and the semiconductor 131. The buffer layer 111 may serve to improve acharacteristic of the polycrystalline semiconductor by blockingimpurities from the insulation substrate 110 during a crystallizationprocess in order to form the polycrystalline semiconductor and to reducestress applied to the insulation substrate 110.

A gate insulating layer 141 covering the semiconductor 131 is formed onthe semiconductor 131. The gate insulating layer 141 may be formed by aninorganic insulating layer.

A scan line 121, a previous scan line 122, an emission control line 123,an initialization voltage line 124, a first driving voltage line 126,and a gate electrode 125 a of the driving thin film transistor T1 whichare formed in a row direction are formed on the gate insulating layer141.

The scan line 121 and the previous scan line 122 have protrusions,respectively, and the protrusion of the scan line 121 protrudes towardthe previous scan line 122, and the protrusion of the previous scan line122 protrudes toward the scan line 121.

First, the protrusion of the scan line 121 protrudes in an upwarddirection of the scan line 121, overlaps the semiconductor 131 c-1 ofthe first compensation thin film transistor T3-1, and configures thegate electrode 125 c-1 of the first compensation thin film transistorT3-1. The source electrode 176 c-1 and the drain electrode 177 c-1 ofthe first compensation thin film transistor T3-1 are not overlapped withthe gate electrode 125 c-1 of the first compensation thin filmtransistor T3-1.

The protrusion of the previous scan line 122 protrudes in a downwarddirection of the previous scan line 122, overlaps the semiconductor 131d-1 of the first initialization thin film transistor T4-1, andconfigures the gate electrode 125 d-1 of the initialization thin filmtransistor T4-1. The source electrode 176 d-1 and the drain electrode177 d-1 of the first initialization thin film transistor T4-1 are notoverlapped with the gate electrode 125 d-1 of the first initializationthin film transistor T4-1.

The emission control line 123 is positioned below the scan line 121, andthe emission control line 123 overlaps the left vertical portion and theright vertical portion, respectively. The emission control line 123overlaps the semiconductor 131 e of the operation control thin filmtransistor T5 of the left vertical portion of the semiconductor 131, butnot overlapped with the source electrode 176 e and the drain electrode177 e of the operation control thin film transistor T5. Further, theemission control line 123 overlaps the semiconductor 131 f of theemission control thin film transistor T6 of the right vertical portionof the semiconductor 131, but not overlapped with the source electrode176 f and the drain electrode 177 f of the emission control thin filmtransistor T6.

The initialization voltage line 124 is positioned above the previousscan line 122, and the initialization voltage line 124 has a partiallyexpanded region. The expanded region of the initialization voltage line124 is to be expanded in order to easily contact another wire.

The first driving voltage line 126 is positioned above theinitialization voltage line 124, and the first driving voltage line 126also has a partially expanded region to easily contact another wire.

The initialization voltage line 124 and the first driving voltage line126 are not overlapped with the semiconductor 131.

The gate electrode 125 a (also referred to as a driving gate electrode)of the driving thin film transistor T1 is formed in a quadrangularshape, and overlapped with the reverse ‘

’-shaped portion of the semiconductor 131, that is, the semiconductor131 a of the driving thin film transistor T1. The source electrode 176 aand the drain electrode 177 a of the driving thin film transistor T1 arenot overlapped with the gate electrode 125 a of the driving thin filmtransistor T1.

An interlayer insulating layer 160 is covered on the scan line 121, theprevious scan line 122, the emission control line 123, theinitialization voltage line 124, the first driving voltage line 126(referred to as a horizontal driving voltage line), the gate electrode125 a of the driving thin film transistor T1, and the exposed gateinsulating layer 141. The interlayer insulating layer 160 may be formedby an inorganic insulating layer.

A plurality of contact holes 161, 162, 163, 164, 165, 166, 167, and 168is formed in the interlayer insulating layer 160. The first contact hole161 exposes the expanded region of the first driving voltage line 126,the second contact hole 162 exposes the expanded region of theinitialization voltage line 124, and the third contact hole 163 exposesthe end (the source electrode 176 d-2 of the second initialization thinfilm transistor T4-2) of the additionally extended ‘

’-shaped portion of the semiconductor 131. The fourth contact hole 164exposes the upper end (the source electrode 176 b of the switching thinfilm transistor T2) of the left vertical portion of the semiconductor131, the fifth contact hole 165 exposes the lower end (the sourceelectrode 176 e of the operation control thin film transistor T5) of theleft vertical portion of the semiconductor 131, the sixth contact hole166 exposes the drain electrode 177 c-1 of the first compensation thinfilm transistor T3-1 which is a part of the ‘

’-shaped portion which is additionally extended from the right verticalportion of the semiconductor 131. The seventh contact hole 167 exposes apartial region of the gate electrode 125 a of the driving thin filmtransistor T1, and the eighth contact hole 168 exposes the lower end(the drain electrode 177 f of the emission control thin film transistorT6) of the right vertical portion of the semiconductor 131.

A data line 171, a second driving voltage line 172 having an expandedregion 175, a first connection part 173, a second connection part 174,and a third connection part 178 are formed on the interlayer insulatinglayer 160.

The data line 171 passes through the fourth contact hole 164 to beextended in a vertical direction, and is connected with the sourceelectrode 176 b of the switching thin film transistor T2 through thefourth contact hole 164. As a result, a data voltage flowing in the dataline 171 is transferred to the source electrode 176 b of the switchingthin film transistor T2.

The second driving voltage line 172 (referred to as a vertical drivingvoltage line) is extended in the vertical direction, and connected withthe first driving voltage line 126 through the first contact hole 161.The first driving voltage line 126 transfers the driving voltage ELVDDin a horizontal direction, and the second driving voltage line 172transfers driving voltage ELVDD in a vertical direction. The seconddriving voltage line 172 has the expanded region 175, and one expandedregion 175 is formed for each pixel. The expanded region 175 of thesecond driving voltage line 172 configures the second electrode 175 ofthe storage capacitor Cst. The driving voltage ELVDD is applied to thesecond electrode 175 of the storage capacitor Cst. The second electrode175 of the storage capacitor Cst overlaps the gate electrode 125 a ofthe driving thin film transistor T1 and the semiconductor 131 a of thedriving thin film transistor T1 having the reverse ‘

’ shape. The storage capacitor Cst includes the gate electrode 125 a ofthe driving thin film transistor T1, the second electrode 175 of thestorage capacitor Cst, and the interlayer insulating layer 160therebetween.

According to the above structure of the second driving voltage line 172,since the second driving voltage line 172 and the second electrode 175of the storage capacitor Cst are simultaneously formed with the samematerial, the electrode of the storage capacitor Cst does not need to beformed on a separate layer, and as a result, the number of masks usedduring manufacturing is decreased. When a unit price of the mask isconsidered, manufacturing costs are reduced and the manufacturing timeis shortened.

According to the present exemplary embodiment, only one type ofinterlayer insulating layer 160 may be provided between the expandedregion 175 (also, referred to as the second electrode 175) of the seconddriving voltage line 172 and the gate electrode 125 a of the drivingthin film transistor T1, and no additional conductive layer may beprovided between a layer where the expanded region 175 is located and alayer where the gate electrode 125 a of the driving thin film transistorT1 is located.

The first connection part 173 connects the initialization voltage line124 and the source electrode 176 d-2 of the second initialization thinfilm transistor T4-2 through the second contact hole 162 and the thirdcontact hole 163. As a result, since the initialization voltage Vint isapplied to the source electrode 176 d-2 of the second initializationthin film transistor T4-2 and the first and second initialization thinfilm transistors T4-1 and T4-2 may be shown as one thin film transistorhaving the dual gate structure, it may be understood that theinitialization voltage Vint is applied to the source electrode of theinitialization thin film transistor T4.

The second connection part 174 connects the drain electrode 177 c-1 ofthe first compensation thin film transistor T3-1 and the gate electrode125 a of the driving thin film transistor T1 through the sixth contacthole 166 and the seventh contact hole 167. As a result, the voltage ofthe drain electrode 177 c-1 of the first compensation thin filmtransistor T3-1 is applied to the gate electrode 125 a of the drivingthin film transistor T1. A part of the gate electrode 125 a of thedriving thin film transistor T1 has an exposed region which is notoverlapped with the expanded region of the second driving voltage line172, and the exposed region is connected with the drain electrode 177c-1 of the first compensation thin film transistor T3-1 through thesecond connection part 174.

The third connection part 178 is formed on the eighth contact hole 168to be connected with the drain electrode 177 f of the emission controlthin film transistor T6. A planarization layer 180 is positioned on thethird connection part 178. A first upper contact hole 181 is included inthe planarization layer 180 to expose the third connection part 178. Apixel electrode 191 is positioned on the planarization layer 180, andthe pixel electrode 191 and the third connection part 178 are connectedto each other through the first upper contact hole 181 of theplanarization layer. As a result, the pixel electrode 191 is connectedwith the drain electrode 177 f of the emission control thin filmtransistor T6. An organic emission layer 370 is positioned on the pixelelectrode 191, and a common electrode 270 is positioned thereon. Thepixel electrode 191, the organic emission layer 370, and the commonelectrode 270 configure an organic light emitting diode 70, and thepixel electrode 191 is an anode of the organic light emitting diode 70.

The driving thin film transistor T1 includes 125 a, 131 a, 176 a, and177 a, the switching thin film transistor T2 is constituted by 125 b,131 b, 176 b, and 177 b, the compensation thin film transistors T3-1 andT3-2 include 125 c-1, 131 c-1, 176 c-1, and 177 c-1, and 125 c-2, 131c-2, 176 c-2, and 177 c-2, respectively, the initialization thin filmtransistors T4-1 and T4-2 include 125 d-1, 131 d-1, 176 d-1, and 177d-1, and 125 d-2, 131 d-2, 176 d-2, and 177 d-2, respectively, theoperation control thin film transistor T5 include 125 e, 131 e, 176 e,and 177 e, and the emission control thin film transistor T6 includes 125f, 131 f, 176 f, and 177 f. Further, the storage capacitor Cst includes125 a and 175. In the semiconductor of each transistor, a channel regionis formed at the portion which overlaps the gate electrode of eachtransistor.

FIGS. 6 to 11 illustrate the order of stages of an embodiment of amanufacturing method for an organic light emitting diode display device,which, for example, may be the device in FIG. 3. First, the organiclight emitting diode display device in which only the semiconductor 131is formed will be described with reference to FIGS. 6 and 7.

The buffer layer 111 protecting the insulation substrate 110 is formedon the insulation substrate 110. The buffer layer 111 may serve to notonly protect the insulation substrate 110, but also prevent the impurityfrom flowing from the insulation substrate 110 to the semiconductor 131when crystallizing the semiconductor 131.

After, amorphous silicon is entirely formed on the buffer layer 111, anda polycrystalline semiconductor layer is formed by crystallizing theamorphous silicon. Thereafter, the polycrystalline semiconductor layeris etched as the semiconductor 131 having the shape in FIG. 6 on thepolycrystalline semiconductor layer using a first mask.

The semiconductor 131 includes vertical portions which are extended in avertical direction at left and right sides based on the semiconductor131 a of the driving thin film transistor T1 having the reverse ‘

’ shape, and two ends of each vertical portion is bent. Further, aportion which is additionally extended to be bent in a ‘

’ shape is on the right vertical portion. The semiconductor 131 is notdoped. As a result, the semiconductor 131 is not divided into thesemiconductor, the source electrode, and the drain electrode configuringeach transistor.

Thereafter, as illustrated in FIGS. 8 and 9, the gate insulating layer141 is covered on the semiconductor 131, and a conductor for a gate islaminated on the gate insulating layer 141, and then etched by using asecond mask. As a result, a scan line 121, a previous scan line 122, anemission control line 123, an initialization voltage line 124, a firstdriving voltage line 126, and a gate electrode 125 a of the driving thinfilm transistor T1 are formed. The scan line 121, the previous scan line122, the emission control line 123, the initialization voltage line 124,and the first driving voltage line 126 are parallel to each other.Further, on the scan line 121 and the previous scan line 122,protrusions are formed, respectively.

Thereafter, the semiconductor 131 is doped. The semiconductor 131 isdoped in an exposed region, except for a portion covered by the scanline 121 having the protrusion, the previous scan line 122 having theprotrusion, the emission control line 123, the initialization voltageline 124, the first driving voltage line 126, and the gate electrode 125a of the driving thin film transistor T1. As a result, the sourceelectrode and the drain electrode of each transistor are formed. Asemiconductor serving as a channel in each transistor is formed in aregion which is covered by the semiconductor 131 and not doped. Thus,when the semiconductor 131 is doped, a separate mask is not required.

The semiconductor 131, when doped, may have the following structure. Thesemiconductor 131 a of the driving thin film transistor T1 has a reverse‘

’ shape, and a source electrode 176 a and a drain electrode 177 a of thedriving thin film transistor T1 are positioned at portions adjacent tothe vertical portions positioned at the left and right sides,respectively. The semiconductor 131 a of the driving thin filmtransistor T1 has the reverse ‘

’ shape in the exemplary embodiment, but may have various shapes, and itis sufficient to have a structure including one or more bent portions.

Further, the semiconductor 131 a of the driving thin film transistor T1includes a plurality of first extensions 31 in a first direction and aplurality of second extensions 32 in a second direction different fromthe first direction, and a bent portion 33 may have a structureconnecting the first extensions 31 and the second extensions 32.

At the left vertical portion connected with the source electrode 176 aof the driving thin film transistor T1, a semiconductor 131 b of theswitching thin film transistor T2 positioned above and a semiconductor131 e of the operation control thin film transistor T5 positioned beloware formed. Between the semiconductor 131 b of the switching thin filmtransistor T2 and the semiconductor 131 e of the operation control thinfilm transistor T5, the drain electrode 177 b of the switching thin filmtransistor T2 and the drain electrode 177 e of the operation controlthin film transistor T5 are positioned to be connected with the sourceelectrode 176 a of the driving thin film transistor T1.

The source electrode 176 b of the switching thin film transistor T2 ispositioned above the semiconductor 131 b of the switching thin filmtransistor T2, and the source electrode 176 e of the operation controlthin film transistor T5 is positioned below the semiconductor 131 e ofthe operation control thin film transistor T5.

At the right vertical portion connected with the drain electrode 177 aof the driving thin film transistor T1, semiconductors 131 c-1 and 131c-2 of the compensation thin film transistors T3-1 and T3-2 positionedabove, and a semiconductor 131 f of the emission control thin filmtransistor T6 positioned below are formed. Between the semiconductors131 c-1 and 131 c-2 of the compensation thin film transistors T3-1 andT3-2 and the semiconductor 131 f of the emission control thin filmtransistor T6, a source electrode 176 c-2 of the second compensationthin film transistor T3-2 of the compensation thin film transistors T3-1and T3-2 and a source electrode 176 f of the emission control thin filmtransistor T6 are positioned to be connected with the drain electrode177 a of the driving thin film transistor T1. A structure of thecompensation thin film transistors T3-1 and T3-2 will be described belowin more detail.

The compensation thin film transistors T3-1 and T3-2 include a firstcompensation thin film transistor T3-1 and a second compensation thinfilm transistor T3-2, and the first compensation thin film transistorT3-1 is positioned based on a protrusion of the scan line 121, and thesecond compensation thin film transistor T3-2 is positioned based on aportion where the scan line 121 and the right vertical portion of thesemiconductor 131 are overlapped with each other.

First, the source electrode 176 c-2 of the second compensation thin filmtransistor T3-2 is connected with the source electrode 176 f of theemission control thin film transistor T6 and the drain electrode 177 aof the driving thin film transistor T1, a gate electrode 125 c-2 ispositioned at a portion of the scan line 121 with which the rightvertical portion of the semiconductor 31 is overlapped, thesemiconductor 131 c-2 is positioned at a portion of the right verticalportion of the semiconductor 131 which overlaps the scan line, and adrain 177 c-2 is positioned above the semiconductor 131 c-2 of the rightvertical portion of the semiconductor 131.

The source electrode 176 c-1 of the first compensation thin filmtransistor T3-1 is connected with the drain 177 c-2 of the secondcompensation thin film transistor T3-2, the gate electrode 125 c-1 ispositioned at the protrusion of the scan line 121, the semiconductor 131c-1 is positioned at a portion of the right vertical portion of thesemiconductor 131 which overlaps the protrusion of the scan line 121,and the drain 177 c-1 is positioned at an opposite side to the sourceelectrode 176 c-1 based on the semiconductor 131 c-1. The firstcompensation thin film transistor T3-1 is positioned at a portion whichis additionally extended in a ‘

’ shape from the right vertical portion of the semiconductor 131 in theexemplary embodiment.

The drain electrode 177 f of the emission control thin film transistorT6 is positioned below the semiconductor 131 f of the emission controlthin film transistor T6, and semiconductors 131 d-1 and 131 d-2 ofinitialization thin film transistors T4-1 and T4-2 are further formed atthe ‘

’-shaped extension which is additionally extended above thesemiconductor 131 c-2 and the drain electrode 177 c-1 of the secondcompensation thin film transistor T3-2. Between the semiconductor 131d-1 of the first initialization thin film transistor T4-1 and the drainelectrode 177 c-1 of the first compensation thin film transistor T3-1,the drain electrode 177 d-1 of the first initialization thin filmtransistor T4-1 is positioned, and the source electrode 176 d-2 of thesecond initialization thin film transistor T4-2 is positioned at an endof the ‘

’-shaped portion which is additionally extended. A structure of theinitialization thin film transistors T4-1 and T4-2 will be describedbelow in more detail.

The initialization thin film transistors T4-1 and T4-2 include a firstinitialization thin film transistor T4-1 and a second initializationthin film transistor T4-2, and the first initialization thin filmtransistor T4-1 is positioned based on a protrusion of the previous scanline 122, and the second initialization thin film transistor T4-2 ispositioned based on a portion where the previous scan line 122 and the ‘

’-shaped portion of the semiconductor 131 are overlapped with eachother.

First, the source electrode 176 d-1 of the first initialization thinfilm transistor T4-1 is connected with the drain electrode 177 c-1 ofthe first compensation thin film transistor T3-1, the gate electrode 125d-1 is positioned at the portion of the previous scan line 122 withwhich the ‘

’-shaped portion of the semiconductor 131 is overlapped, thesemiconductor 131 d-1 is positioned at a portion of the ‘

’-shaped portion of the semiconductor 131 which overlaps the protrusionof the previous scan line 122, and the drain 177 d-1 is positioned at anopposite side to the source electrode 176 d-1 based on the semiconductor131 d-1.

The source electrode 176 d-2 of the second initialization thin filmtransistor T4-2 is connected with the drain 177 d-1 of the firstinitialization thin film transistor T4-1, the gate electrode 125 d-2 ispositioned at the portion of the previous scan line 122 with which the ‘

’-shaped portion of the semiconductor 131 is overlapped, thesemiconductor 131 d-2 is positioned at a portion of the ‘

’-shaped portion of the semiconductor 131 which overlaps the previousscan line 122, and the drain 177 d-2 is positioned at an end of the ‘

’-shaped portion of the semiconductor 131, as an opposite side to thesource electrode 176 d-2 based on the semiconductor 131 d-2.

Thereafter, as illustrated in FIGS. 10 and 11, after the interlayerinsulating layer 160 is covered, a plurality of contact holes 161, 162,163, 164, 165, 166, 167, and 168 is formed in the interlayer insulatinglayer 160 by using a third mask. Thereafter, a conductor for data islaminated on the interlayer insulating layer 160 and then etched byusing a fourth mask. As a result, a data line 171, a second drivingvoltage line 172 having an expanded region 175, a first connection part173, a second connection part 174, and a third connection part 178 areformed.

The data line 171 passes through the fourth contact hole 164 to beextended in a vertical direction, and is connected with the sourceelectrode 176 b of the switching thin film transistor T2 through thefourth contact hole 164. As a result, a data voltage flowing in the dataline 171 is transferred to the source electrode 176 b of the switchingthin film transistor T2.

The second driving voltage line 172 is extended in the verticaldirection, and connected with the first driving voltage line 126 throughthe first contact hole 161. The first driving voltage line 126 transfersthe driving voltage ELVDD in a horizontal direction, and the seconddriving voltage line 172 transfers driving voltage ELVDD in a verticaldirection. The second driving voltage line 172 has the expanded region,and one expanded region is formed for each pixel. The expanded region ofthe second driving voltage line 172 configures the second electrode 175of the storage capacitor Cst. The driving voltage ELVDD is applied tothe second electrode 175 of the storage capacitor Cst. The secondelectrode 175 of the storage capacitor Cst overlaps the gate electrode125 a of the thin film transistor T1 and the semiconductor 131 a of thedriving thin film transistor T1 having the reverse ‘

’ shape. The storage capacitor Cst is constituted by the gate electrode125 a of the thin film transistor T1, the second electrode 175 of thestorage capacitor Cst, and the interlayer insulating layer 160therebetween.

The first connection part 173 connects the initialization voltage line124 and the source electrode 176 d-2 of the second initialization thinfilm transistor T4-2 through the second contact hole 162 and the thirdcontact hole 163. As a result, since the initialization voltage Vint isapplied to the source electrode 176 d-2 of the second initializationthin film transistor T4-2 and the first and second initialization thinfilm transistors T4-1 and T4-2 may be shown as one thin film transistorhaving the dual gate structure, it may be understood that theinitialization voltage Vint is applied to the source electrode of theinitialization thin film transistor T4.

The second connection part 174 connects the drain electrode 177 c-1 ofthe first compensation thin film transistor T3-1 and the gate electrode125 a of the thin film transistor T1 through the sixth contact hole 166and the seventh contact hole 167. As a result, the voltage of the drainelectrode 177 c-1 of the first compensation thin film transistor T3-1 isapplied to the gate electrode 125 a of the driving thin film transistorT1. A part of the gate electrode 125 a of the driving thin filmtransistor T1 has an exposed region which is not overlapped with theexpanded region of the second driving voltage line 172, and the exposedregion is connected with the drain electrode 177 c-1 of the firstcompensation thin film transistor T3-1 through the second connectionpart 174.

The third connection part 178 is formed on the eighth contact hole 168to be connected with the drain electrode 177 f of the emission controlthin film transistor T6.

Thereafter, referring back to FIG. 5, the planarization layer 180covering the data line 171, the second driving voltage line 172 havingthe expanded region 175, the first connection part 173, the secondconnection part 174, and the third connection part 178 are laminated.Thereafter, the first upper contact hole 181 exposing the thirdconnection part 178 is formed by using a fifth mask. Thereafter, on theplanarization layer 180, the pixel electrode 191 is formed by using asixth mask, and the pixel electrode 191 is electrically connected withthe exposed third connection part 178 to be connected with the drainelectrode 177 f of the emission control thin film transistor T6.

Thereafter, a partition wall is formed on the pixel electrode 191 byusing a seventh mask, and the organic emission layer 370 is formedbetween the partition walls. Thereafter, the common electrode 270 isformed on the organic emission layer 370. Since the common electrode 270is formed over the entire region, a separate mask is not used. As aresult, the pixel electrode 191, the organic emission layer 370, and thecommon electrode 270 configure an organic light emitting diode 70, andthe pixel electrode 191 is an anode of the organic light emitting diode70.

According to the above manufacturing method, since the expanded regionof the second driving voltage line 172 configures the second electrode175 of the storage capacitor Cst, the electrode of the storage capacitorCst does not need to be formed on a separate layer. As a result, thenumber of masks used during the manufacturing process is reduced. When aunit price of the mask is considered, manufacturing costs are reducedand manufacturing time is shortened.

FIGS. 12 to 14 illustrate another layout embodiment of an organic lightemitting diode display device. In FIGS. 12 to 14, the same circuitconfiguration as FIG. 1 is included, but unlike FIGS. 3 to 5 the firstdriving voltage line is not formed on the same layer as the scan line121 but is formed on the same layer as the pixel electrode 191. Thefirst driving voltage line 192 in FIG. 12 contacts the second drivingvoltage line 172 by the first contact hole, but the first contact holeis positioned in the planarization layer 180. Further, the first drivingvoltage line 192 (referred also to as a horizontal driving voltage line)overlaps the initialization voltage line 124 on the layout view.

Specifically, FIG. 12 illustrates a layout embodiment of a pixel of theorganic light emitting diode display device, FIG. 13 illustrates alayout embodiment including three adjacent pixels in the organic lightemitting diode display device, and FIG. 14 illustrates a cross-sectionalview of the organic light emitting diode display device of FIG. 12 takenalong line XIV-XIV.

Referring to FIG. 12, the pixel includes the scan line 121, the previousscan line 122, the emission control line 123, and the initializationvoltage line 124 which apply the scan signal Sn, the previous scansignal Sn−1, the emission control signal Em, and the initializationvoltage Vint, respectively and are formed in a row direction, asillustrated in FIG. 2, and includes a data line 171 which cross all ofthe scan line 121, the previous scan line 122, the emission control line123, and the initialization voltage line 124 and apply a data signal Dmto the pixel.

The driving voltage lines 192/172 applying the driving voltage ELVDD arealso included, and the driving voltage lines 192/172 are constituted bythe first driving voltage line 192 parallel with the scan line 121 andpositioned on the same layer as the pixel electrode 191, and the seconddriving voltage line 172 parallel with the data line 171. The firstdriving voltage line 192 and the second driving voltage line 172 areelectrically connected with each other. The first driving voltage line192 electrically connects two or more of the second driving voltagelines 172 in a horizontal direction such that the driving voltage ELVDDis transmitted in the horizontal direction.

The pixel includes a driving thin film transistor T1, a switching thinfilm transistor T2, compensation thin film transistors T3-1 and T3-2,initialization thin film transistors T4-1 and T4-2, an operation controlthin film transistor T5, an emission control thin film transistor T6, astorage capacitor Cst, and an organic light emitting diode. Referring toFIG. 12, the compensation thin film transistors T3-1 and T3-2 and theinitialization thin film transistors T4-1 and T4-2 have a dual gatestructure, and hereinafter will be described as transistors areconnected to each other.

Channels of the driving thin film transistor T1, the switching thin filmtransistor T2, the compensation thin film transistors T3-1 and T3-2, theinitialization thin film transistors T4-1 and T4-2, the operationcontrol thin film transistor T5, and the emission control thin filmtransistor T6 are formed within one connected semiconductor 131, and thesemiconductor 131 is formed to be bent in various shapes. Thesemiconductor 131 according to FIG. 3 includes vertical portions whichare extended in a vertical direction (a direction parallel with the dataline 171) at left and right sides based on a semiconductor 131 a of thedriving thin film transistor T1, and two ends of each vertical portionare bent. Further, a portion which is additionally extended to be bentin a ‘

’ shape is included on the right vertical portion.

The semiconductor 131 a of the driving thin film transistor T1 has areverse ‘

’ shape, most of the reverse ‘

’ shape configures the semiconductor 131 a of the driving thin filmtransistor T1, and a source electrode 176 a and a drain electrode 177 aof the driving thin film transistor T1 are positioned at portionsadjacent to the vertical portions positioned at the left and rightsides, respectively. The semiconductor 131 a of the driving thin filmtransistor T1 has the reverse ‘

’ shape in the exemplary embodiment, but may have various shapes, and itis sufficient to have a structure including one or more bent portions.Further, the semiconductor 131 a of the driving thin film transistor T1includes a plurality of first extensions 31 extended in a firstdirection and a plurality of second extensions 32 extended in a seconddirection different from the first direction, and a bent portion 33 mayhave a structure connecting the first extensions 31 and the secondextensions 32.

At the left vertical portion connected with the source electrode 176 aof the driving thin film transistor T1, a semiconductor 131 b of theswitching thin film transistor T2 positioned above and a semiconductor131 e of the operation control thin film transistor T5 positioned beloware formed. Between the semiconductor 131 b of the switching thin filmtransistor T2 and the semiconductor 131 e of the operation control thinfilm transistor T5, the drain electrode 177 b of the switching thin filmtransistor T2 and the drain electrode 177 e of the operation controlthin film transistor T5 are positioned to be connected with the sourceelectrode 176 a of the driving thin film transistor T1.

The source electrode 176 b of the switching thin film transistor T2 ispositioned above the semiconductor 131 b of the switching thin filmtransistor T2, and the source electrode 176 e of the operation controlthin film transistor T5 is positioned below the semiconductor 131 e ofthe operation control thin film transistor T5.

At the right vertical portion connected with the drain electrode 177 aof the driving thin film transistor T1, semiconductors 131 c-1 and 131c-2 of the compensation thin film transistors T3-1 and T3-2 positionedabove, and a semiconductor 131 f of the emission control thin filmtransistor T6 positioned below are formed. Between the semiconductors131 c-1 and 131 c-2 of the compensation thin film transistors T3-1 andT3-2 and the semiconductor 131 f of the emission control thin filmtransistor T6, a source electrode 176 c-2 of the second compensationthin film transistor T3-2 of the compensation thin film transistors T3-1and T3-2 and a source electrode 176 f of the emission control thin filmtransistor T6 are positioned to be connected with the drain electrode177 a of the driving thin film transistor T1. A structure of thecompensation thin film transistors T3-1 and T3-2 will be described belowin more detail.

The compensation thin film transistors T3-1 and T3-2 include a firstcompensation thin film transistor T3-1 and a second compensation thinfilm transistor T3-2, and the first compensation thin film transistorT3-1 is positioned based on a protrusion of the scan line 121, and thesecond compensation thin film transistor T3-2 is positioned based on aportion where the scan line 121 and the right vertical portion of thesemiconductor 131 are overlapped with each other.

First, the source electrode 176 c-2 of the second compensation thin filmtransistor T3-2 is connected with the source electrode 176 f of theemission control thin film transistor T6 and the drain electrode 177 aof the driving thin film transistor T1, a gate electrode 125 c-2 ispositioned at a portion of the scan line 121 with which the rightvertical portion is overlapped, the semiconductor 131 c-2 is positionedat a portion of the right vertical portion of the semiconductor 131which overlaps the scan line, and a drain 177 c-2 is positioned abovethe semiconductor 131 c-2 of the right vertical portion of thesemiconductor 131.

The source electrode 176 c-1 of the first compensation thin filmtransistor T3-1 is connected with the drain 177 c-2 of the secondcompensation thin film transistor T3-2, the gate electrode 125 c-1 ispositioned at the protrusion of the scan line 121, the semiconductor 131c-1 is positioned at a portion of the right vertical portion of thesemiconductor 131 which overlaps the protrusion of the scan line 121,and the drain 177 c-1 is positioned at an opposite side to the sourceelectrode 176 c-1 based on the semiconductor 131 c-1. The firstcompensation thin film transistor T3-1 is positioned at a portion whichis additionally extended in a ‘

’ shape from the right vertical portion of the semiconductor 131.

The drain electrode 177 f of the emission control thin film transistorT6 is positioned below the semiconductor 131 f of the emission controlthin film transistor T6, and semiconductors 131 d-1 and 131 d-2 ofinitialization thin film transistors T4-1 and T4-2 are further formed atthe ‘

’-shaped additional extension which is additionally extended above thesemiconductor 131 c-2 and the drain electrode 177 c-1 of the secondcompensation thin film transistor T3-2. Between the semiconductor 131d-1 of the first initialization thin film transistor T4-1 and the drainelectrode 177 c-1 of the first compensation thin film transistor T3-1,the drain electrode 177 d-1 of the first initialization thin filmtransistor T4-1 is positioned, and the source electrode 176 d-2 of thesecond initialization thin film transistor T4-2 is positioned at an endof the ‘

’-shaped portion which is additionally extended. A structure of theinitialization thin film transistors T4-1 and T4-2 will be describedbelow in more detail.

The initialization thin film transistors T4-1 and T4-2 include a firstinitialization thin film transistor T4-1 and a second initializationthin film transistor T4-2, and the first initialization thin filmtransistor T4-1 is positioned based on a protrusion of the previous scanline 122, and the second initialization thin film transistor T4-2 ispositioned based on a portion where the previous scan line 122 and the ‘

’-shaped portion of the semiconductor 131 are overlapped with eachother.

First, the source electrode 176 d-1 of the first initialization thinfilm transistor T4-1 is connected with the drain electrode 177 c-1 ofthe first compensation thin film transistor T3-1, the gate electrode 125d-1 is positioned at the portion of the previous scan line 122 withwhich the ‘

’-shaped portion of the semiconductor 131 is overlapped, thesemiconductor 131 d-1 is positioned at a portion of the ‘

’-shaped portion of the semiconductor 131 which overlaps the protrusionof the previous scan line 122, and the drain 177 d-1 is positioned at anopposite side to the source electrode 176 d-1 based on the semiconductor131 d-1.

The source electrode 176 d-2 of the second initialization thin filmtransistor T4-2 is connected with the drain 177 d-1 of the firstinitialization thin film transistor T4-1, the gate electrode 125 d-2 ispositioned at the portion of the previous scan line 122 with which the ‘

’-shaped portion of the semiconductor 131 is overlapped, thesemiconductor 131 d-2 is positioned at a portion of the ‘

’-shaped portion of the semiconductor 131 which overlaps the previousscan line 122, and the drain 177 d-2 is positioned at an end of the ‘

’-shaped portion of the semiconductor 131, as an opposite side to thesource electrode 176 d-2 based on the semiconductor 131 d-2.

The semiconductor 131 may have a different structure in otherembodiments. The semiconductor 131 may include, for example, apolycrystalline semiconductor. The source electrode/drain electrodesformed in the semiconductor 131 may be formed by doping only thecorresponding region. Further, in the semiconductor 131, a regionbetween a source electrode and a drain electrode of differenttransistors is doped. Thus, the source electrode and the drain electrodemay be electrically connected to each other.

The semiconductor 131 is formed on an insulation substrate 110, and abuffer layer 111 may be positioned between the insulation substrate 110and the semiconductor 131. The buffer layer 111 may serve to improve acharacteristic of the polycrystalline semiconductor by blockingimpurities from the insulation substrate 110 during a crystallizationprocess in order to form the polycrystalline semiconductor and to reducestress applied to the insulation substrate 110.

A gate insulating layer 141 covering the semiconductor 131 is formed onthe semiconductor 131. The gate insulating layer 141 may be formed by aninorganic insulating layer.

A scan line 121, a previous scan line 122, an emission control line 123,an initialization voltage line 124, a first driving voltage line 126,and a gate electrode 125 a of the driving thin film transistor T1 whichare formed in a row direction are formed on the gate insulating layer141.

The scan line 121 and the previous scan line 122 have protrusions,respectively, and the protrusion of the scan line 121 protrudes towardthe previous scan line 122, and the protrusion of the previous scan line122 protrudes toward the scan line 121.

First, the protrusion of the scan line 121 protrudes in an upwarddirection of the scan line 121, overlaps the semiconductor 131 c-1 ofthe first compensation thin film transistor T3-1, and configures thegate electrode 125 c-1 of the first compensation thin film transistorT3-1. The source electrode 176 c-1 and the drain electrode 177 c-1 ofthe first compensation thin film transistor T3-1 are not overlapped withthe gate electrode 125 c-1 of the first compensation thin filmtransistor T3-1.

The protrusion of the previous scan line 122 protrudes in a downwarddirection of the previous scan line 122, overlaps the semiconductor 131d-1 of the first initialization thin film transistor T4-1, andconfigures the gate electrode 125 d-1 of the first initialization thinfilm transistor T4-1. The source electrode 176 d-1 and the drainelectrode 177 d-1 of the first initialization thin film transistor T4-1are not overlapped with the gate electrode 125 d-1 of the firstinitialization thin film transistor T4-1.

The emission control line 123 is positioned below the scan line 121, andthe emission control line 123 overlaps the left vertical portion and theright vertical portion of the semiconductor 131, respectively. Theemission control line 123 overlaps the semiconductor 131 e of theoperation control thin film transistor T5 of the left vertical portionof the semiconductor 131, but not overlapped with the source electrode176 e and the drain electrode 177 e of the operation control thin filmtransistor T5. Further, the emission control line 123 overlaps thesemiconductor 131 f of the emission control thin film transistor T6 ofthe right vertical portion of the semiconductor 131, but not overlappedwith the source electrode 176 f and the drain electrode 177 f of theemission control thin film transistor T6.

The initialization voltage line 124 is positioned above the previousscan line 122, and the initialization voltage line 124 has a partiallyexpanded region. The expanded region of the initialization voltage line124 is to be expanded in order to easily contact another wire. Theinitialization voltage line 124 overlaps the first driving voltage line192 on the plan view. The initialization voltage line 124 is notoverlapped with the semiconductor 131.

The gate electrode 125 a of the driving thin film transistor T1 isformed in a quadrangular shape, and overlapped with the reverse ‘

’-shaped portion of the semiconductor 131, that is, the semiconductor131 a of the driving thin film transistor T1. The source electrode 176 aand the drain electrode 177 a of the driving thin film transistor T1 arenot overlapped with the gate electrode 125 a of the driving thin filmtransistor T1.

An interlayer insulating layer 160 is covered on the scan line 121, theprevious scan line 122, the emission control line 123, theinitialization voltage line 124, the gate electrode 125 a of the drivingthin film transistor T1, and the exposed gate insulating layer 141. Theinterlayer insulating layer 160 may be formed by an inorganic insulatinglayer.

A plurality of contact holes 161, 162, 163, 164, 165, 166, 167, and 168is formed in the interlayer insulating layer 160. The second contacthole 162 exposes the expanded region of the initialization voltage line124, and the third contact hole 163 exposes the end (the sourceelectrode 176 d-2 of the second initialization thin film transistorT4-2) of the additionally extended ‘

’-shaped portion of the semiconductor 131. The fourth contact hole 164exposes the upper end (the source electrode 176 b of the switching thinfilm transistor T2) of the left vertical portion of the semiconductor131, the fifth contact hole 165 exposes the lower end (the sourceelectrode 176 e of the operation control thin film transistor T5) of theleft vertical portion of the semiconductor 131, the sixth contact hole166 exposes the drain electrode 177 c-1 of the first compensation thinfilm transistor T3-1 which is a part of the ‘

’-shaped portion which is additionally extended from the right verticalportion of the semiconductor 131. The seventh contact hole 167 exposes apartial region of the gate electrode 125 a of the driving thin filmtransistor T1, and the eighth contact hole 168 exposes the lower end(the drain electrode 177 f of the emission control thin film transistorT6) of the right vertical portion of the semiconductor 131.

A data line 171, a second driving voltage line 172 having an expandedregion 175, a first connection part 173, a second connection part 174,and a third connection part 178 are formed on the interlayer insulatinglayer 160.

The data line 171 passes through the fourth contact hole 164 to beextended in a vertical direction, and is connected with the sourceelectrode 176 b of the switching thin film transistor T2 through thefourth contact hole 164. As a result, a data voltage flowing in the dataline 171 is transferred to the source electrode 176 b of the switchingthin film transistor T2.

The second driving voltage line 172 is extended in a vertical direction,and the driving voltage ELVDD is transferred in the vertical direction.The second driving voltage line 172 has the expanded region, and oneexpanded region is formed for each pixel. The expanded region of thesecond driving voltage line 172 configures the second electrode 175 ofthe storage capacitor Cst. The driving voltage ELVDD is applied to thesecond electrode 175 of the storage capacitor Cst. The second electrode175 of the storage capacitor Cst overlaps the gate electrode 125 a ofthe thin film transistor T1 and the semiconductor 131 a of the drivingthin film transistor T1 having the reverse ‘

’ shape. The storage capacitor Cst is constituted by the gate electrode125 a of the thin film transistor T1, the second electrode 175 of thestorage capacitor Cst, and the interlayer insulating layer 160therebetween.

According to the above structure of the second driving voltage line 172,since the second driving voltage line 172 and the second electrode 175of the storage capacitor Cst are formed together with the same material,the electrode of the storage capacitor Cst does not need to be formed ona separate layer. As a result, the number of masks used duringmanufacturing is decreased. When a unit price of the mask is considered,manufacturing costs are reduced and the manufacturing time is shortened.

The first connection part 173 connects the initialization voltage line124 and the source electrode 176 d-2 of the second initialization thinfilm transistor T4-2 through the second contact hole 162 and the thirdcontact hole 163. As a result, since the initialization voltage Vint isapplied to the source electrode 176 d-2 of the second initializationthin film transistor T4-2 and the first and second initialization thinfilm transistors T4-1 and T4-2 may be shown as one thin film transistorhaving the dual gate structure, it may be understood that theinitialization voltage Vint is applied to the source electrode of theinitialization thin film transistor T4.

The second connection part 174 connects the drain electrode 177 c-1 ofthe first compensation thin film transistor T3-1 and the gate electrode125 a of the thin film transistor T1 through the sixth contact hole 166and the seventh contact hole 167. As a result, the voltage of the drainelectrode 177 c-1 of the first compensation thin film transistor T3-1 isapplied to the gate electrode 125 a of the driving thin film transistorT1. A part of the gate electrode 125 a of the driving thin filmtransistor T1 has an exposed region which is not overlapped with theexpanded region of the second driving voltage line 172, and the exposedregion is connected with the drain electrode 177 c-1 of the firstcompensation thin film transistor T3-1 through the second connectionpart 174.

The third connection part 178 is formed on the eighth contact hole 168to be connected with the drain electrode 177 f of the emission controlthin film transistor T6. A planarization layer 180 is positioned on thethird connection part 178. In the planarization layer 180, a first uppercontact hole 181 exposing the third connection part 178 and a secondupper contact hole 182 exposing a part of the first driving voltage line192 exist, and the second driving voltage line 172 is exposed by thesecond upper contact hole 182.

The pixel electrode 191 and the first driving voltage line 192 areformed on the planarization layer 180. First, the pixel electrode 191 isconnected with the third connection part 178 through the first uppercontact hole 181 of the planarization layer 180. As a result, the pixelelectrode 191 is connected with the drain electrode 177 f of theemission control thin film transistor T6.

The first driving voltage line 192 is extended in a horizontal directionlike the scan line 121, and has a partially expanded region to easilycontact another wire. The first driving voltage line 192 is electricallyconnected with the second driving voltage line 172 by the second uppercontact hole 182, and the first driving voltage line 192 transfers thedriving voltage ELVDD in a horizontal direction. The first drivingvoltage line 192 overlaps the initialization voltage line 124 on thelayout view in order to reduce an area of the pixel.

An organic emission layer 370 is positioned on the pixel electrode 191,and a common electrode 270 is positioned thereon. The pixel electrode191, the organic emission layer 370, and the common electrode 270configure an organic light emitting diode 70, and the pixel electrode191 is an anode of the organic light emitting diode 70.

The driving thin film transistor T1 is constituted by 125 a, 131 a, 176a, and 177 a, the switching thin film transistor T2 is constituted by125 b, 131 b, 176 b, and 177 b, the compensation thin film transistorsT3-1 and T3-2 are constituted by 125 c-1, 131 c-1, 176 c-1, and 177 c-1,and 125 c-2, 131 c-2, 176 c-2, and 177 c-2, respectively, theinitialization thin film transistors T4-1 and T4-2 are constituted by125 d-1, 131 d-1, 176 d-1, and 177 d-1, and 125 d-2, 131 d-2, 176 d-2,and 177 d-2, respectively, the operation control thin film transistor T5is constituted by 125 e, 131 e, 176 e, and 177 e, and the emissioncontrol thin film transistor T6 is constituted by 125 f, 131 f, 176 f,and 177 f Further, the storage capacitor Cst is constituted by 125 a and175.

Even in the exemplary embodiment of FIGS. 12 to 14, the organic lightemitting diode display device may be manufactured based on themanufacturing method of the exemplary embodiment of FIGS. 3 to 5.

FIGS. 15 and 16 illustrate another embodiment of an organic lightemitting diode display device. Specifically, FIG. 15 illustrates anotherembodiment of a pixel of an organic light emitting diode display device,and FIG. 16 is a timing diagram illustrating an example of controlsignals for the pixel.

FIG. 15 illustrates an equivalent circuit diagram of the pixel based onFIG. 1, but unlike FIG. 1, a bypass thin film transistor T7 is includedand part of a driving current ld is discharged as a bypass current Ibpthrough the bypass thin film transistor T7 according to a bypass signalBP.

As illustrated in FIG. 15, the pixel includes a plurality of signallines, a plurality of thin film transistors connected to the pluralityof signal lines, a storage capacitor Cst, and an organic light emittingdiode OLED. The thin film transistors include a driving thin filmtransistor T1, a switching thin film transistor T2, a compensation thinfilm transistor T3, an initialization thin film transistor T4, anoperation control thin film transistor T5, an emission control thin filmtransistor T6, and a bypass thin film transistor T7.

The signal lines include a scan line 121 transferring a scan signal Sn,a previous scan line 122 transferring a previous scan signal Sn−1 to theinitialization thin film transistor T4, an emission control line 123transferring an emission control signal Em to the operation control thinfilm transistor T5 and the emission control thin film transistor T6, adata line 171 crossing the scan line 121 and transferring a data signalDm, driving voltage lines 126/172 transferring a driving voltage ELVDD,an initialization voltage line 124 transferring an initializationvoltage Vint initializing the driving thin film transistor T1, and abypass control line 128 transferring a bypass signal BP to the bypassthin film transistor T7. The driving voltage lines 126/172 areconstituted by a first driving voltage line 126 parallel with the scanline 121 and a second driving voltage line 172 parallel with the dataline 171, and the first driving voltage line 126 and the second drivingvoltage line 172 are electrically connected to each other.

A gate electrode G1 of the driving thin film transistor T1 is connectedwith one end Cst1 of the storage capacitor Cst, a source electrode S1 ofthe driving thin film transistor T1 is connected with the drivingvoltage lines 126/172 via the operation control thin film transistor T5,a drain electrode D1 of the driving thin film transistor T1 iselectrically connected with an anode of the organic light emitting diodeOLED via the emission control thin film transistor T6. The driving thinfilm transistor T1 receives the data signal Dm according to a switchingoperation of the switching thin film transistor T2 to supply a drivingcurrent to the organic light emitting diode OLED.

A gate electrode G2 of the switching thin film transistor T2 isconnected with the scan line 121, a source electrode S2 of the switchingthin film transistor T2 is connected with the data line 171, and a drainelectrode D2 of the switching thin film transistor T2 is connected withthe source electrode S1 of the driving thin film transistor T1 andsimultaneously, connected with the driving voltage lines 126/172 via theoperation control thin film transistor T5. The switching thin filmtransistor T2 is turned on according to the scan signal Sn receivedthrough the scan line 121 to perform a switching operation transferringthe data signal Dm transferred to the data line 171 to the sourceelectrode of the driving thin film transistor T1.

A gate electrode G3 of the compensation thin film transistor T3 isconnected with the scan line 121, a source electrode S3 of thecompensation thin film transistor T3 is connected with the drainelectrode D1 of the driving thin film transistor T1 and simultaneously,connected with an anode of the organic light emitting diode OLED via theemission control transistor T6, and a drain electrode D3 of thecompensation thin film transistor T3 is connected with one end Cst1 ofthe storage capacitor Cst, the drain electrode D4 of the initializationthin film transistor T4, and the gate electrode G1 of the driving thinfilm transistor T1 together. The compensation thin film transistor T3 isturned on according to the scan signal Sn received through the scan line121 to connect the gate electrode G1 and the drain electrode D1 of thedriving thin film transistor T1 and diode-connect the driving thin filmtransistor T1.

A gate electrode G4 of the initialization thin film transistor T4 isconnected with a previous scan line 122, a source electrode S4 of theinitialization thin film transistor T4 is connected with theinitialization voltage line 124, and a drain electrode D4 of theinitialization thin film transistor T4 is simultaneously connected withone end Cst1 of the storage capacitor Cst, the drain electrode D3 of thecompensation thin film transistor T3, and the gate electrode G1 of thedriving thin film transistor T1. The initialization thin film transistorT4 is turned on according to the previous scan signal Sn−1 receivedthrough the previous scan line 122 to transfer the initializationvoltage Vint to the gate electrode G1 of the driving thin filmtransistor T1 and then perform an initialization operation initializinga voltage of the gate electrode G1 of driving thin film transistor T1.

A gate electrode G5 of the operation control thin film transistor T5 isconnected with the emission control line 123, a source electrode S5 ofthe operation control thin film transistor T5 is connected with thedriving voltage lines 126/172, and a drain electrode D5 of the operationcontrol thin film transistor T5 is connected with the source electrodeS1 of the driving thin film transistor T1 and the drain electrode D2 ofthe switching thin film transistor T2.

A gate electrode G6 of the emission control thin film transistor T6 isconnected with the emission control line 123, a source electrode S6 ofthe emission control thin film transistor T6 is connected with the drainelectrode D1 of the driving thin film transistor T1 and the sourceelectrode S3 of the compensation thin film transistor T3, and a drainelectrode D6 of the emission control thin film transistor T6 iselectrically connected with an anode of the organic light emitting diodeOLED. The operation control thin film transistor T5 and emission controlthin film transistor T6 are simultaneously turned on according to theemission control signal Em received through the emission control line123, and the driving voltage ELVDD is transferred to the organic lightemitting diode OLED and thus a driving current flows in the organiclight emitting diode OLED.

The bypass thin film transistor T7 receives the bypass signal BP fromthe bypass control line 128. The bypass signal BP is a voltage having apredetermined level which may always turn off the bypass thin filmtransistor T7, the bypass thin film transistor T7 receives a voltagehaving a transistor off level from the gate electrode G7, and thus thebypass thin film transistor T7 is always turned off, and a part of thedriving current ld flows out through the bypass thin film transistor T7as a bypass current Ibp in the off state.

The other end Cst2 of the storage capacitor Cst is connected with thedriving voltage lines 126/172, and a cathode of the organic lightemitting diode OLED is connected with the common voltage ELVSS. As aresult, the organic light emitting diode OLED receives the drivingcurrent from the driving thin film transistor T1 to emit light, therebydisplaying an image.

Referring to FIG. 16, first, in an initializing period, the previousscan signal Sn−1 having a low level is supplied through the previousscan line 122. In this case, the emission control signal Em is alreadyapplied at the low level through the emission control line 123. Then,the initialization thin film transistor T4 is turned on based on theprevious scan signal Sn−1 having the low level, the initializationvoltage Vint is supplied from the initialization voltage line 124 to thegate electrode of the driving thin film transistor T1 through theinitialization thin film transistor T4, and the driving thin filmtransistor T1 is initialized by the initialization voltage Vint.

Thereafter, in a data programming period, the scan signal Sn having thelow level is supplied through the scan line 121. Then, the switchingthin film transistor T2 and the compensation thin film transistor T3 areturned on based on the scan signal Sn having the low level. In thiscase, the driving thin film transistor T1 is diode-connected by theturned-on compensation thin film transistor T3 and biased in a forwarddirection.

Then, a compensation voltage Dm+Vth (Vth is a negative (−) value)reduced from the data signal Dm supplied from the data line 171 by athreshold voltage Vth of the driving thin film transistor T1 is appliedto the gate electrode of the driving thin film transistor T1. Thedriving voltage ELVDD and the compensation voltage Dm+Vth are applied toboth ends of the storage capacitor Cst, and a charge corresponding to avoltage difference between both ends is stored in the storage capacitorCst.

Thereafter, in the emission period, the emission control signal Emsupplied from the emission control line 123 is changed from the highlevel to the low level. Then, for the emission period, the operationcontrol thin film transistor T5 and the emission control thin filmtransistor T6 are turned on by the emission control signal Em of the lowlevel.

Then, a driving current is generated according to a voltage differencebetween the voltage of the gate electrode of the driving thin filmtransistor T1 and the driving voltage ELVDD, and a driving current IOLEDis supplied to the organic light emitting diode OLED through theemission control thin film transistor T6. For the emission period, thegate-source electrode voltage Vgs of the driving thin film transistor T1is maintained at ‘(Dm+Vth)−ELVDD’ by the storage capacitor Cst, andaccording to a current-voltage relationship of the driving thin filmtransistor T1, the driving current ld is proportional to the square‘(Dm−ELVDD)2’ of a value obtained by subtracting the threshold voltagefrom the source-gate electrode voltage. Accordingly, the driving currentIOLED is determined regardless of the threshold voltage Vth of thedriving thin film transistor T1.

The bypass thin film transistor T7 receives the bypass signal BP fromthe bypass control line 128. The bypass signal BP is a voltage having apredetermined level which may always turn off the bypass thin filmtransistor T7, the bypass thin film transistor T7 receives a voltagehaving a transistor off level from the gate electrode G7, and thus thebypass thin film transistor T7 is always turned off, and a part of thedriving current ld flows out through the bypass thin film transistor T7as a bypass current Ibp in the off state.

Even in the case where a minimum current of the driving thin filmtransistor for displaying a black image flows as the driving current,when the organic light emitting diode OLED emits light, the black imageis not displayed well. Accordingly, the bypass thin film transistor T7may distribute a part of the minimum current of the driving thin filmtransistor T1 as the bypass current Ibp to another current path otherthan the current path of the organic light emitting diode side. Theminimum current of the driving thin film transistor T1 corresponds to acurrent under a condition in which the driving thin film transistor isturned off, because the gate-source voltage Vgs of the driving thin filmtransistor is smaller than the threshold voltage Vth. The minimumdriving current (for example, current of 10 pA or less) under thecondition in which the driving thin film transistor is turned off istransferred to the organic light emitting diode to be expressed as animage at black luminance.

When the minimum driving current expressing the black image flows, aninfluence on a bypass transfer of the bypass current Ibp is large.However, when a large driving current expressing an image such as anormal image or a white image flows, there may be little influence onthe bypass current Ibp. Accordingly, when the driving current displayinga black image flows, the emission current holed of the organic lightemitting diode which is reduced by the current amount of the bypasscurrent Ibp which flows out from the driving current ld through thebypass thin film transistor T7 has a minimum current amount as a levelwhich may exactly express the black image.

Therefore, a black luminance image is exactly implemented by using thebypass thin film transistor, thereby improving a contrast ratio.

In FIG. 16, since as the bypass signal BP, the same signal as theprevious scan signal Sn−1 is supplied, the previous scan line 122instead of the bypass control line 128 may be connected to the bypassthin film transistor T7. In this case, the bypass control line 128 maybe omitted.

FIGS. 17 to 19 illustrate a detailed structure of another embodiment ofan organic light emitting diode display device. 15. Specifically, FIG.17 illustrates another layout embodiment of a pixel, FIG. 18 is anotherlayout embodiment of three adjacent pixels, and FIG. 19 illustrates across-sectional view of the organic light emitting diode display deviceof FIG. 17 taken along line XIX-XIX.

As illustrated in FIG. 16, the pixel includes a scan line 121, aprevious scan line 122, an emission control line 123, a bypass controlline 128, and an initialization voltage line 124 which apply a scansignal Sn, a previous scan signal Sn−1, an emission control signal Em, abypass signal BP, and an initialization voltage Vint, respectively, andare formed in a row direction, and includes a data line 171 whichcrosses all of the scan line 121, the previous scan line 122, theemission control line 123, the bypass control line 128, and theinitialization voltage line 124 and applies a data signal Dm to thepixel.

The pixel also includes the driving voltage lines 126/172 for applyingthe driving voltage ELVDD. The driving voltage lines 126/172 areconstituted by the first driving voltage line 126 parallel with the scanline 121 and the second driving voltage line 172 parallel with the dataline 171. The first driving voltage line 126 and the second drivingvoltage line 172 are electrically connected with each other.

The pixel also includes a driving thin film transistor T1, a switchingthin film transistor T2, compensation thin film transistors T3-1 andT3-2, initialization thin film transistors T4-1 and T4-2, an operationcontrol thin film transistor T5, an emission control thin filmtransistor T6, a bypass thin film transistor T7, a storage capacitorCst, and an organic light emitting diode OLED are formed. Referring tothe exemplary embodiment of FIG. 17, the compensation thin filmtransistors T3-1 and T3-2 and the initialization thin film transistorsT4-1 and T4-2 have a dual gate structure, and hereinafter will bedescribed as transistors connected to each other.

Channels of the driving thin film transistor T1, the switching thin filmtransistor T2, the compensation thin film transistors T3-1 and T3-2, theinitialization thin film transistors T4-1 and T4-2, the operationcontrol thin film transistor T5, and the emission control thin filmtransistor T6 are formed within one connected semiconductor 131, and thesemiconductor 131 is formed to be bent in various shapes. Thesemiconductor 131 according to the exemplary embodiment of FIG. 17includes vertical portions which are extended in a vertical direction (adirection parallel with the data line 171) at left and right sides basedon a semiconductor 131 a of the driving thin film transistor T1, and twoends of each vertical portion are bent. Further, a portion which isadditionally extended to be bent in a ‘

’ shape is included above the right vertical portion, and a portionwhich is additionally extended downwards is included below the rightvertical portion.

The semiconductor 131 a of the driving thin film transistor T1 has areverse ‘

’ shape, most of the reverse ‘

’ shape configures the semiconductor 131 a of the driving thin filmtransistor T1, and a source electrode 176 a and a drain electrode 177 aof the driving thin film transistor T1 are positioned at portionsadjacent to the vertical portions positioned at the left and rightsides, respectively. The semiconductor 131 a of the driving thin filmtransistor T1 has the reverse ‘

’ shape in the exemplary embodiment. In another embodiment, thesemiconductor 131 a may have a different shape and/or one or more bentportions. Further, the semiconductor 131 a of the driving thin filmtransistor T1 includes a plurality of first extensions 31 extended in afirst direction and a plurality of second extensions 32 extended in asecond direction different from the first direction, and a bent portion33 may have a structure connecting the first extensions 31 and thesecond extensions 32.

At the left vertical portion connected with the source electrode 176 aof the driving thin film transistor T1, a semiconductor 131 b of theswitching thin film transistor T2 positioned above and a semiconductor131 e of the operation control thin film transistor T5 positioned beloware formed. Between the semiconductor 131 b of the switching thin filmtransistor T2 and the semiconductor 131 e of the operation control thinfilm transistor T5, the drain electrode 177 b of the switching thin filmtransistor T2 and the drain electrode 177 e of the operation controlthin film transistor T5 are positioned to be connected with the sourceelectrode 176 a of the driving thin film transistor T1.

The source electrode 176 b of the switching thin film transistor T2 ispositioned above the semiconductor 131 b of the switching thin filmtransistor T2, and the source electrode 176 e of the operation controlthin film transistor T5 is positioned below the semiconductor 131 e ofthe operation control thin film transistor T5.

At the right vertical portion connected with the drain electrode 177 aof the driving thin film transistor T1, semiconductors 131 c-1 and 131c-2 of the compensation thin film transistors T3-1 and T3-2 positionedabove, and a semiconductor 131 f of the emission control thin filmtransistor T6 positioned below are formed. Between the semiconductors131 c-1 and 131 c-2 of the compensation thin film transistors T3-1 andT3-2 and the semiconductor 131 f of the emission control thin filmtransistor T6, a source electrode 176 c-2 of the second compensationthin film transistor T3-2 of the compensation thin film transistors T3-1and T3-2 and a source electrode 176 f of the emission control thin filmtransistor T6 are positioned to be connected with the drain electrode177 a of the driving thin film transistor T1. A structure of thecompensation thin film transistors T3-1 and T3-2 will be described belowin more detail.

The compensation thin film transistors T3-1 and T3-2 include a firstcompensation thin film transistor T3-1 and a second compensation thinfilm transistor T3-2, and the first compensation thin film transistorT3-1 is positioned based on a protrusion of the scan line 121, and thesecond compensation thin film transistor T3-2 is positioned based on aportion where the scan line 121 and the right vertical portion of thesemiconductor 131 are overlapped with each other. First, the sourceelectrode 176 c-2 of the second compensation thin film transistor T3-2is connected with the source electrode 176 f of the emission controlthin film transistor T6 and the drain electrode 177 a of the drivingthin film transistor T1, a gate electrode 125 c-2 is positioned at aportion of the scan line 121 with which the right vertical portion isoverlapped, the semiconductor 131 c-2 is positioned at a portion of theright vertical portion of the semiconductor 131 which overlaps the scanline 121, and a drain 177 c-2 is positioned above the semiconductor 131c-2 of the right vertical portion of the semiconductor 131.

Meanwhile, the source electrode 176 c-1 of the first compensation thinfilm transistor T3-1 is connected with the drain 177 c-2 of the secondcompensation thin film transistor T3-2, the gate electrode 125 c-1 ispositioned at the protrusion of the scan line 121, the semiconductor 131c-1 is positioned at a portion of the right vertical portion of thesemiconductor 131 which overlaps the protrusion of the scan line 121,and the drain 177 c-1 is positioned at an opposite side to the sourceelectrode 176 c-1 based on the semiconductor 131 c-1. The firstcompensation thin film transistor T3-1 is positioned at a portion whichis additionally extended in a ‘

’ shape from the right vertical portion of the semiconductor 131.

The drain electrode 177 f of the emission control thin film transistorT6 is positioned below the semiconductor 131 f of the emission controlthin film transistor T6, and semiconductors 131 d-1 and 131 d-2 ofinitialization thin film transistors T4-1 and T4-2 are further formed atthe ‘

’-shaped additional extension which is additionally extended above thesemiconductor 131 c-2 and the drain electrode 177 c-1 of the secondcompensation thin film transistor T3-2. Between the semiconductor 131d-1 of the first initialization thin film transistor T4-1 and the drainelectrode 177 c-1 of the first compensation thin film transistor T3-1,the drain electrode 177 d-1 of the first initialization thin filmtransistor T4-1 is positioned, and the source electrode 176 d-2 of thesecond initialization thin film transistor T4-2 is positioned at an endof the ‘

’-shaped portion which is additionally extended. A structure of theinitialization thin film transistors T4-1 and T4-2 will be describedbelow in more detail.

The initialization thin film transistors T4-1 and T4-2 include a firstinitialization thin film transistor T4-1 and a second initializationthin film transistor T4-2, and the first initialization thin filmtransistor T4-1 is positioned based on a protrusion of the scan line122, and the second initialization thin film transistor T4-2 ispositioned based on a portion where the scan line 122 and the ‘

’-shaped portion of the semiconductor 131 are overlapped with eachother.

First, the source electrode 176 d-1 of the first initialization thinfilm transistor T4-1 is connected with the drain electrode 177 c-1 ofthe first compensation thin film transistor T3-1, the gate electrode 125d-1 is positioned at the portion of the previous scan line 122 withwhich the ‘

’-shaped portion of the semiconductor 131 is overlapped, thesemiconductor 131 d-1 is positioned at a portion of the ‘

’-shaped portion of the semiconductor 131 which overlaps the protrusionof the previous scan line 122, and the drain 177 d-1 is positioned at anopposite side to the source electrode 176 d-1 based on the semiconductor131 d-1.

The source electrode 176 d-2 of the second initialization thin filmtransistor T4-2 is connected with the drain 177 d-1 of the firstinitialization thin film transistor T4-1, the gate electrode 125 d-2 ispositioned at the portion of the previous scan line 122 with which the ‘

’-shaped portion of the semiconductor 131 is overlapped, thesemiconductor 131 d-2 is positioned at a portion of the ‘

’-shaped portion of the semiconductor 131 which overlaps the previousscan line 122, and the drain 177 d-2 is positioned at an end of the ‘

’-shaped portion of the semiconductor 131, as an opposite side to thesource electrode 176 d-2 based on the semiconductor 131 d-2.

Further, a portion which is additionally extended downwards ispositioned below the drain electrode 177 f of the emission control thinfilm transistor T6. A source electrode 176 g of the bypass thin filmtransistor T7 is positioned at a side adjacent to the drain electrode177 f of the emission control thin film transistor T6, and next, asemiconductor 131 g of the bypass thin film transistor T7 and a drainelectrode 177 g of the bypass thin film transistor T7 are sequentiallypositioned.

The semiconductor 131 may have a different structure in anotherembodiment. The semiconductor 131 may include, for example, apolycrystalline semiconductor. The source electrode/drain electrodesformed in the semiconductor 131 may be formed by doping only thecorresponding region. Further, in the semiconductor 131, an area betweena source electrode and a drain electrode of different transistors isdoped and thus the source electrode and the drain electrode may beelectrically connected to each other.

The semiconductor 131 is formed on an insulation substrate 110, and abuffer layer 111 may be positioned between the insulation substrate 110and the semiconductor 131. The buffer layer 111 may serve to improve acharacteristic of the polycrystalline semiconductor by blockingimpurities from the insulation substrate 110 during a crystallizationprocess in order to form the polycrystalline semiconductor and reducestress applied to the insulation substrate 110.

A gate insulating layer 141 covering the semiconductor 131 is formed onthe semiconductor 131. The gate insulating layer 141 may be formed by aninorganic insulating layer.

A scan line 121, a previous scan line 122, an emission control line 123,an initialization voltage line 124, a first driving voltage line 126, abypass control line 128, and a gate electrode 125 a of the driving thinfilm transistor T1 which are formed in a row direction are formed on thegate insulating layer 141.

The scan line 121 and the previous scan line 122 have protrusions,respectively, and the protrusion of the scan line 121 protrudes towardthe previous scan line 122, and the protrusion of the previous scan line122 protrudes toward the scan line 121.

First, the protrusion of the scan line 121 protrudes in an upwarddirection of the scan line 121, overlaps the semiconductor 131 c-1 ofthe first compensation thin film transistor T3-1, and configures thegate electrode 125 c-1 of the first compensation thin film transistorT3-1. The source electrode 176 c-1 and the drain electrode 177 c-1 ofthe first compensation thin film transistor T3-1 are not overlapped withthe gate electrode 125 c-1 of the first compensation thin filmtransistor T3-1.

The protrusion of the previous scan line 122 protrudes in a downwarddirection of the previous scan line 122, overlaps the semiconductor 131d-1 of the first initialization thin film transistor T4-1, andconfigures the gate electrode 125 d-1 of the first initialization thinfilm transistor T4-1. The source electrode 176 d-1 and the drainelectrode 177 d-1 of the first initialization thin film transistor T4-1are not overlapped with the gate electrode 125 d-1 of the firstinitialization thin film transistor T4-1.

The emission control line 123 is positioned below the scan line 121, andthe emission control line 123 overlaps the left vertical portion and theright vertical portion, respectively. The emission control line 123overlaps the semiconductor 131 e of the operation control thin filmtransistor T5 of the left vertical portion of the semiconductor 131, butnot overlapped with the source electrode 176 e and the drain electrode177 e of the operation control thin film transistor T5. Further, theemission control line 123 overlaps the semiconductor 131 f of theemission control thin film transistor T6 of the right vertical portionof the semiconductor 131, but not overlapped with the source electrode176 f and the drain electrode 177 f of the emission control thin filmtransistor T6.

The initialization voltage line 124 is positioned above the previousscan line 122, and the initialization voltage line 124 has a partiallyexpanded area. The expanded area of the initialization voltage line 124is expanded in order to easily contact another wire.

The first driving voltage line 126 is positioned above theinitialization voltage line 124, and the first driving voltage line 126also has a partially expanded area to easily contact another wire.

The initialization voltage line 124 and the first driving voltage line126 are not overlapped with the semiconductor 131.

The bypass control line 128 is extended in a horizontal direction at thebottom of the pixel and overlapped with the additional extension belowthe right vertical portion of the semiconductor 131, and a semiconductor131 g of the bypass thin film transistor T7 is positioned at theoverlapped additional extension.

The gate electrode 125 a of the driving thin film transistor T1 isformed in a quadrangular shape, and overlapped with the reverse ‘

’-shaped portion of the semiconductor 131, that is, the semiconductor131 a of the driving thin film transistor T1. The source electrode 176 aand the drain electrode 177 a of the driving thin film transistor T1 arenot overlapped with the gate electrode 125 a of the driving thin filmtransistor T1.

An interlayer insulating layer 160 is covered on the scan line 121, theprevious scan line 122, the emission control line 123, theinitialization voltage line 124, the first driving voltage line 126, thebypass control line 128, the gate electrode 125 a of the driving thinfilm transistor T1, and the exposed gate insulating layer 141. Theinterlayer insulating layer 160 may be formed by an inorganic insulatinglayer.

A plurality of contact holes 161, 162, 163, 164, 165, 166, 167, 168, and169 is formed in the interlayer insulating layer 160. The first contacthole 161 exposes the expanded area of the first driving voltage line126, the second contact hole 162 exposes the expanded area of theinitialization voltage line 124, and the third contact hole 163 exposesthe end (the source electrode 176 d-2 of the second initialization thinfilm transistor T4-2) of the additionally extended ‘

’-shaped portion of the semiconductor 131. The fourth contact hole 164exposes the upper end (the source electrode 176 b of the switching thinfilm transistor T2) of the left vertical portion of the semiconductor131, the fifth contact hole 165 exposes the lower end (the sourceelectrode 176 e of the operation control thin film transistor T5) of theleft vertical portion of the semiconductor 131, the sixth contact hole166 exposes the drain electrode 177 c-1 of the first compensation thinfilm transistor T3-1 which is a part of the ‘

’-shaped portion which is additionally extended from the right verticalportion of the semiconductor 131. The seventh contact hole 167 exposes apartial area of the gate electrode 125 a of the driving thin filmtransistor T1, and the eighth contact hole 168 exposes the lower end(the source electrode 176 f of the emission control thin film transistorT6) of the right vertical portion of the semiconductor 131. Further, theninth contact hole 169 exposes the end (the drain electrode 177 g of thebypass thin film transistor T7) of the additional extension below theright vertical portion of the semiconductor 131.

A data line 171, a second driving voltage line 172 having an expandedarea 175, a first connection part 173, a second connection part 174, anda third connection part 178 are formed on the interlayer insulatinglayer 160.

The data line 171 passes through the fourth contact hole 164 to beextended in a vertical direction, and is connected with the sourceelectrode 176 b of the switching thin film transistor T2 through thefourth contact hole 164. As a result, a data voltage flowing in the dataline 171 is transferred to the source electrode 176 b of the switchingthin film transistor T2.

The second driving voltage line 172 is extended in the verticaldirection, and connected with the first driving voltage line 126 throughthe first contact hole 161. The first driving voltage line 126 transfersthe driving voltage ELVDD in a horizontal direction, and the seconddriving voltage line 172 transfers driving voltage ELVDD in a verticaldirection. The second driving voltage line 172 has the expanded region,and one expanded region is formed for each pixel. The expanded region ofthe second driving voltage line 172 configures the second electrode 175of the storage capacitor Cst. The driving voltage ELVDD is applied tothe second electrode 175 of the storage capacitor Cst. The secondelectrode 175 of the storage capacitor Cst overlaps the gate electrode125 a of the thin film transistor T1 and the semiconductor 131 a of thedriving thin film transistor T1 having the reverse ‘

’ shape. The storage capacitor Cst is constituted by the gate electrode125 a of the thin film transistor T1, the second electrode 175 of thestorage capacitor Cst, and the interlayer insulating layer 160therebetween.

According to the above structure of the second driving voltage line 172,since the second driving voltage line 172 and the second electrode 175of the storage capacitor Cst are formed together with the same material,the electrode of the storage capacitor Cst does not need to be formed ona separate layer. As a result, the number of masks used duringmanufacturing is decreased. When a unit price of the mask is considered,manufacturing costs are reduced and the manufacturing time is shortened.

The first connection part 173 connects the initialization voltage line124, the source electrode 176 d-2 of the second initialization thin filmtransistor T4-2, and the drain electrode 177 g of the bypass thin filmtransistor T7 through the second contact hole 162, the third contacthole 163, and the ninth contact hole 169. As a result, theinitialization voltage Vint is applied to the source electrode 176 d-2of the second initialization thin film transistor T4-2 and the drainelectrode 177 g of the bypass thin film transistor T7. Here, since thefirst and second initialization thin film transistors T4-1 and T4-2 maybe shown as one thin film transistor having a dual gate structure, itmay be understood that the initialization voltage Vint is applied to thesource electrode of the initialization thin film transistor T4.

The second connection part 174 connects the drain electrode 177 c-1 ofthe first compensation thin film transistor T3-1 and the gate electrode125 a of the thin film transistor T1 through the sixth contact hole 166and the seventh contact hole 167. As a result, the voltage of the drainelectrode 177 c-1 of the first compensation thin film transistor T3-1 isapplied to the gate electrode 125 a of the driving thin film transistorT1. A part of the gate electrode 125 a of the driving thin filmtransistor T1 has an exposed region which is not overlapped with theexpanded region of the second driving voltage line 172, and the exposedregion is connected with the drain electrode 177 c-1 of the firstcompensation thin film transistor T3-1 through the second connectionpart 174.

The third connection part 178 is formed on the eighth contact hole 168to be connected with the source electrode 176 f of the emission controlthin film transistor T6. A planarization layer 180 is positioned on thethird connection part 178. A first upper contact hole 181 is included inthe planarization layer 180 to expose the third connection part 178. Apixel electrode 191 is positioned on the planarization layer 180, andthe pixel electrode 191 and the connection part 178 are connected toeach other through the first upper contact hole 181 of the planarizationlayer. As a result, the pixel electrode 191 is connected with the sourceelectrode 176 f of the emission control thin film transistor T6. Anorganic emission layer 370 is positioned on the pixel electrode 191, anda common electrode 270 is positioned thereon. The pixel electrode 191,the organic emission layer 370, and the common electrode 270 configurean organic light emitting diode 70, and the pixel electrode 191 is ananode of the organic light emitting diode 70.

The driving thin film transistor T1 is constituted by 125 a, 131 a, 176a, and 177 a, the switching thin film transistor T2 is constituted by125 b, 131 b, 176 b, and 177 b, the compensation thin film transistorsT3-1 and T3-2 are constituted by 125 c-1, 131 c-1, 176 c-1, and 177 c-1,and 125 c-2, 131 c-2, 176 c-2, and 177 c-2, respectively, theinitialization thin film transistors T4-1 and T4-2 are constituted by125 d-1, 131 d-1, 176 d-1, and 177 d-1, and 125 d-2, 131 d-2, 176 d-2,and 177 d-2, respectively, the operation control thin film transistor T5is constituted by 125 e, 131 e, 176 e, and 177 e, the emission controlthin film transistor T6 is constituted by 125 f, 131 f, 176 f, and 177f, and the bypass thin film transistor T7 is constituted by 125 g, 131g, 176 g, and 177 g. Further, the storage capacitor Cst is constitutedby 125 a and 175.

Even in the exemplary embodiment of FIGS. 17 to 19, the organic lightemitting diode display device may be manufactured based on themanufacturing method of the exemplary embodiment of FIGS. 3 to 5.

FIGS. 20 to 22 illustrating another embodiment of an organic lightemitting diode display device. In FIGS. 20 to 22, the same circuitconfiguration as FIG. 15 is included. However, unlike FIGS. 17 to 19,there is a difference in that the first driving voltage line is notformed on the same layer as the scan line 121, but formed on the samelayer as the pixel electrode 191. The first driving voltage line 192 inthe exemplary embodiment of FIG. 20 contacts the second driving voltageline 172 by the first contact hole, but the first contact hole ispositioned in the planarization layer 180. Further, the first drivingvoltage line 192 overlaps the initialization voltage line 124 on thelayout view.

FIG. 20 illustrates another layout embodiment of a pixel, FIG. 21illustrates another layout embodiment of three adjacent pixels, and FIG.22 illustrates a cross-sectional view of the organic light emittingdiode display device of FIG. 20 taken along line XXII-XXII.

The pixel in FIG. 20 includes a scan line 121, a previous scan line 122,an emission control line 123, a bypass control line 128, and aninitialization voltage line 124 which apply a scan signal Sn, a previousscan signal Sn−1, an emission control signal Em, a bypass signal BP, andan initialization voltage Vint, respectively and are formed in a rowdirection, and includes a data line 171 which crosses all of the scanline 121, the previous scan line 122, the emission control line 123, thebypass control line 128, and the initialization voltage line 124 andapplies a data signal Dm to the pixel.

The pixel also includes the driving voltage lines 192/172 applying thedriving voltage ELVDD. The driving voltage lines 192/172 are constitutedby the first driving voltage line 192 parallel with the scan line 121and positioned on the same layer as the pixel electrode 191, and thesecond driving voltage line 172 parallel with the data line 171. Thefirst driving voltage line 192 and the second driving voltage line 172are electrically connected with each other.

The pixel also includes a driving thin film transistor T1, a switchingthin film transistor T2, compensation thin film transistors T3-1 andT3-2, initialization thin film transistors T4-1 and T4-2, an operationcontrol thin film transistor T5, an emission control thin filmtransistor T6, a bypass thin film transistor T7, a storage capacitorCst, and an organic light emitting diode OLED are formed. Referring tothe exemplary embodiment of FIG. 20, the compensation thin filmtransistors T3-1 and T3-2 and the initialization thin film transistorsT4-1 and T4-2 have a dual gate structure, and hereinafter, will bedescribed as transistors connected to each other.

Channels of the driving thin film transistor T1, the switching thin filmtransistor T2, the compensation thin film transistors T3-1 and T3-2, theinitialization thin film transistors T4-1 and T4-2, the operationcontrol thin film transistor T5, and the emission control thin filmtransistor T6 are formed within one connected semiconductor 131, and thesemiconductor 131 is formed to be bent in various shapes. Thesemiconductor 131 according to the exemplary embodiment of FIG. 17includes vertical portions which are extended in a vertical direction (adirection parallel with the data line 171) at left and right sides basedon a semiconductor 131 a of the driving thin film transistor T1, and twoends of each vertical portion are bent. Further, a portion which isadditionally extended to be bent in a ‘

’ shape is included above the right vertical portion, and a portionwhich is additionally extended downwards is included below the rightvertical portion.

The semiconductor 131 a of the driving thin film transistor T1 has areverse ‘

’ shape, most of the reverse ‘

’ shape configures the semiconductor 131 a of the driving thin filmtransistor T1, and a source electrode 176 a and a drain electrode 177 aof the driving thin film transistor T1 are positioned at portionsadjacent to the vertical portions positioned at the left and rightsides, respectively. The semiconductor 131 a of the driving thin filmtransistor T1 has the reverse ‘

’ shape in the exemplary embodiment, but may have various shapes, and itis better to have a structure including one or more bent portions.Further, the semiconductor 131 a of the driving thin film transistor T1includes a plurality of first extensions 31 extended in a firstdirection and a plurality of second extensions 32 extended in a seconddirection different from the first direction, and a bent portion 33 mayhave a structure connecting the first extensions 31 and the secondextensions 32.

At the left vertical portion connected with the source electrode 176 aof the driving thin film transistor T1, a semiconductor 131 b of theswitching thin film transistor T2 positioned above and a semiconductor131 e of the operation control thin film transistor T5 positioned beloware formed. Between the semiconductor 131 b of the switching thin filmtransistor T2 and the semiconductor 131 e of the operation control thinfilm transistor T5, the drain electrode 177 b of the switching thin filmtransistor T2 and the drain electrode 177 e of the operation controlthin film transistor T5 are positioned to be connected with the sourceelectrode 176 a of the driving thin film transistor T1.

The source electrode 176 b of the switching thin film transistor T2 ispositioned above the semiconductor 131 b of the switching thin filmtransistor T2, and the source electrode 176 e of the operation controlthin film transistor T5 is positioned below the semiconductor 131 e ofthe operation control thin film transistor T5.

At the right vertical portion connected with the drain electrode 177 aof the driving thin film transistor T1, semiconductors 131 c-1 and 131c-2 of the compensation thin film transistors T3-1 and T3-2 positionedabove, and a semiconductor 131 f of the emission control thin filmtransistor T6 positioned below are formed. Between the semiconductors131 c-1 and 131 c-2 of the compensation thin film transistors T3-1 andT3-2 and the semiconductor 131 f of the emission control thin filmtransistor T6, a source electrode 176 c-2 of the second compensationthin film transistor T3-2 of the compensation thin film transistors T3-1and T3-2 and a source electrode 176 f of the emission control thin filmtransistor T6 are positioned to be connected with the drain electrode177 a of the driving thin film transistor T1. A structure of thecompensation thin film transistors T3-1 and T3-2 will be described belowin more detail.

The compensation thin film transistors T3-1 and T3-2 include a firstcompensation thin film transistor T3-1 and a second compensation thinfilm transistor T3-2, and the first compensation thin film transistorT3-1 is positioned based on a protrusion of the scan line 121, and thesecond compensation thin film transistor T3-2 is positioned based on aportion where the scan line 121 and the right vertical portion of thesemiconductor 131 are overlapped with each other.

First, the source electrode 176 c-2 of the second compensation thin filmtransistor T3-2 is connected with the source electrode 176 f of theemission control thin film transistor T6 and the drain electrode 177 aof the driving thin film transistor T1, a gate electrode 125 c-2 ispositioned at a portion of the scan line 121 with which the rightvertical portion of the semiconductor 131 is overlapped, thesemiconductor 131 c-2 is positioned at a portion of the right verticalportion of the semiconductor 131 which overlaps the scan line, and adrain 177 c-2 is positioned above the semiconductor 131 c-2 of the rightvertical portion of the semiconductor 131.

The source electrode 176 c-1 of the first compensation thin filmtransistor T3-1 is connected with the drain 177 c-2 of the secondcompensation thin film transistor T3-2, the gate electrode 125 c-1 ispositioned at the protrusion of the scan line 121, the semiconductor 131c-1 is positioned at a portion of the right vertical portion of thesemiconductor 131 which overlaps the protrusion of the scan line 121,and the drain 177 c-1 is positioned at an opposite side to the sourceelectrode 176 c-1 based on the semiconductor 131 c-1. The firstcompensation thin film transistor T3-1 is positioned at a portion whichis additionally extended in a ‘

’ shape from the right vertical portion of the semiconductor 131.

The drain electrode 177 f of the emission control thin film transistorT6 is positioned below the semiconductor 131 f of the emission controlthin film transistor T6, and semiconductors 131 d-1 and 131 d-2 ofinitialization thin film transistors T4-1 and T4-2 are further formed atthe ‘

’-shaped additional extension which is additionally extended above thesemiconductor 131 c-2 and the drain electrode 177 c-1 of the secondcompensation thin film transistor T3-2. Between the semiconductor 131d-1 of the first initialization thin film transistor T4-1 and the drainelectrode 177 c-1 of the first compensation thin film transistor T3-1,the drain electrode 177 d-1 of the first initialization thin filmtransistor T4-1 is positioned, and the source electrode 176 d-2 of thesecond initialization thin film transistor T4-2 is positioned at an endof the ‘

’-shaped portion which is additionally extended. A structure of theinitialization thin film transistors T4-1 and T4-2 will be describedbelow in more detail.

The initialization thin film transistors T4-1 and T4-2 include a firstinitialization thin film transistor T4-1 and a second initializationthin film transistor T4-2, and the first initialization thin filmtransistor T4-1 is positioned based on a protrusion of the previous scanline 122, and the second initialization thin film transistor T4-2 ispositioned based on a portion where the previous scan line 122 and the ‘

’-shaped portion of the semiconductor 131 are overlapped with eachother.

First, the source electrode 176 d-1 of the first initialization thinfilm transistor T4-1 is connected with the drain electrode 177 c-1 ofthe first compensation thin film transistor T3-1, the gate electrode 125d-1 is positioned at the portion of the previous scan line 122 withwhich the ‘

’-shaped portion of the semiconductor 131 is overlapped, thesemiconductor 131 d-1 is positioned at a portion of the ‘

’-shaped portion of the semiconductor 131 which overlaps the protrusionof the previous scan line 122, and the drain 177 d-1 is positioned at anopposite side to the source electrode 176 d-1 based on the semiconductor131 d-1.

The source electrode 176 d-2 of the second initialization thin filmtransistor T4-2 is connected with the drain 177 d-1 of the firstinitialization thin film transistor T4-1, the gate electrode 125 d-2 ispositioned at the portion of the previous scan line 122 with which the ‘

’-shaped portion of the semiconductor 131 is overlapped, thesemiconductor 131 d-2 is positioned at a portion of the ‘

’-shaped portion of the semiconductor 131 which overlaps the previousscan line 122, and the drain 177 d-2 is positioned at an end of the ‘

’-shaped portion of the semiconductor 131, as an opposite side to thesource electrode 176 d-2 based on the semiconductor 131 d-2.

Further, a portion which is additionally extended downwards ispositioned below the drain electrode 177 f of the emission control thinfilm transistor T6. A source electrode 176 g of the bypass thin filmtransistor T7 is positioned at a side adjacent to the drain electrode177 f of the emission control thin film transistor T6, and next, asemiconductor 131 g of the bypass thin film transistor T7 and a drainelectrode 177 g of the bypass thin film transistor T7 are sequentiallypositioned.

The semiconductor 131 may have a different structure in anotherembodiment. The semiconductor 131 may include, for example, apolycrystalline semiconductor. The source electrode/drain electrodesformed in the semiconductor 131 may be formed by doping only thecorresponding region. Further, in the semiconductor 131, an area betweena source electrode and a drain electrode of different transistors isdoped and thus the source electrode and the drain electrode may beelectrically connected to each other.

The semiconductor 131 is formed on an insulation substrate 110, and abuffer layer 111 may be positioned between the insulation substrate 110and the semiconductor 131. The buffer layer 111 may serve to improve acharacteristic of the polycrystalline semiconductor by blockingimpurities from the insulation substrate 110 during a crystallizationprocess in order to form the polycrystalline semiconductor and to reducestress applied to the insulation substrate 110.

A gate insulating layer 141 covering the semiconductor 131 is formed onthe semiconductor 131. The gate insulating layer 141 may be formed by aninorganic insulating layer.

A scan line 121, a previous scan line 122, an emission control line 123,an initialization voltage line 124, a bypass control line 128, and agate electrode 125 a of the driving thin film transistor T1 which areformed in a row direction are formed on the gate insulating layer 141.The scan line 121 and the previous scan line 122 have protrusions,respectively, and the protrusion of the scan line 121 protrudes towardthe previous scan line 122, and the protrusion of the previous scan line122 protrudes toward the scan line 121.

First, the protrusion of the scan line 121 protrudes in an upwarddirection of the scan line 121, overlaps the semiconductor 131 c-1 ofthe first compensation thin film transistor T3-1, and configures thegate electrode 125 c-1 of the first compensation thin film transistorT3-1. The source electrode 176 c-1 and the drain electrode 177 c-1 ofthe first compensation thin film transistor T3-1 are not overlapped withthe gate electrode 125 c-1 of the first compensation thin filmtransistor T3-1.

The protrusion of the previous scan line 122 protrudes in a downwarddirection of the previous scan line 122, overlaps the semiconductor 131d-1 of the first initialization thin film transistor T4-1, andconfigures the gate electrode 125 d-1 of the first initialization thinfilm transistor T4-1. The source electrode 176 d-1 and the drainelectrode 177 d-1 of the first initialization thin film transistor T4-1are not overlapped with the gate electrode 125 d-1 of the firstinitialization thin film transistor T4-1.

The emission control line 123 is positioned below the scan line 121, andthe emission control line 123 overlaps the left vertical portion and theright vertical portion of the semiconductor 131, respectively. Theemission control line 123 overlaps the semiconductor 131 e of theoperation control thin film transistor T5 of the left vertical portionof the semiconductor 131, but not overlapped with the source electrode176 e and the drain electrode 177 e of the operation control thin filmtransistor T5. Further, the emission control line 123 overlaps thesemiconductor 131 f of the emission control thin film transistor T6 ofthe right vertical portion of the semiconductor 131, but not overlappedwith the source electrode 176 f and the drain electrode 177 f of theemission control thin film transistor T6.

The initialization voltage line 124 is positioned above the previousscan line 122, and the initialization voltage line 124 has a partiallyexpanded area. The expanded area of the initialization voltage line 124is to be expanded in order to easily contact another wire. Theinitialization voltage line 124 is not overlapped with the semiconductor131.

The bypass control line 128 is extended in a horizontal direction at thebottom of the pixel and overlapped with the additional extension belowthe right vertical portion of the semiconductor 131, and a semiconductor131 g of the bypass thin film transistor T7 is positioned at theoverlapped additional extension.

The gate electrode 125 a of the driving thin film transistor T1 isformed in a quadrangular shape, and overlapped with the reverse ‘

’-shaped portion of the semiconductor 131, that is, the semiconductor131 a of the driving thin film transistor T1. The source electrode 176 aand the drain electrode 177 a of the driving thin film transistor T1 arenot overlapped with the gate electrode 125 a of the driving thin filmtransistor T1.

An interlayer insulating layer 160 is covered on the scan line 121, theprevious scan line 122, the emission control line 123, theinitialization voltage line 124, the bypass control line 128, the gateelectrode 125 a of the driving thin film transistor T1, and the exposedgate insulating layer 141. The interlayer insulating layer 160 may beformed by an inorganic insulating layer.

A plurality of contact holes 161, 162, 163, 164, 165, 166, 167, 168, and169 is formed in the interlayer insulating layer 160. The second contacthole 162 exposes the expanded region of the initialization voltage line124, and the third contact hole 163 exposes the end (the sourceelectrode 176 d-2 of the second initialization thin film transistorT4-2) of the additionally extended ‘

’-shaped portion of the semiconductor 131. The fourth contact hole 164exposes the upper end (the source electrode 176 b of the switching thinfilm transistor T2) of the left vertical portion of the semiconductor131, the fifth contact hole 165 exposes the lower end (the sourceelectrode 176 e of the operation control thin film transistor T5) of theleft vertical portion of the semiconductor 131, the sixth contact hole166 exposes the drain electrode 177 c-1 of the first compensation thinfilm transistor T3-1 which is a part of the ‘

’-shaped portion which is additionally extended from the right verticalportion of the semiconductor 131. The seventh contact hole 167 exposes apartial area of the gate electrode 125 a of the driving thin filmtransistor T1, and the eighth contact hole 168 exposes the lower end(the source electrode 176 f of the emission control thin film transistorT6) of the right vertical portion of the semiconductor 131. Further, theninth contact hole 169 exposes the end (the drain electrode 177 g of thebypass thin film transistor T7) of the additional extension below theright vertical portion of the semiconductor 131.

A data line 171, a second driving voltage line 172 having an expandedarea 175, a first connection part 173, a second connection part 174, anda third connection part 178 are formed on the interlayer insulatinglayer 160.

The data line 171 passes through the fourth contact hole 164 to beextended in a vertical direction, and is connected with the sourceelectrode 176 b of the switching thin film transistor T2 through thefourth contact hole 164. As a result, a data voltage flowing in the dataline 171 is transferred to the source electrode 176 b of the switchingthin film transistor T2.

The second driving voltage line 172 is extended in a vertical direction,and the driving voltage ELVDD is transferred in the vertical direction.The second driving voltage line 172 has the expanded region, and oneexpanded region is formed for each pixel. The expanded region of thesecond driving voltage line 172 configures the second electrode 175 ofthe storage capacitor Cst. The driving voltage ELVDD is applied to thesecond electrode 175 of the storage capacitor Cst. The second electrode175 of the storage capacitor Cst overlaps the gate electrode 125 a ofthe thin film transistor T1 and the semiconductor 131 a of the drivingthin film transistor T1 having the reverse shape. The storage capacitorCst is constituted by the gate electrode 125 a of the thin filmtransistor T1, the second electrode 175 of the storage capacitor Cst,and the interlayer insulating layer 160 therebetween.

According to the above structure of the second driving voltage line 172,since the second driving voltage line 172 and the second electrode 175of the storage capacitor Cst are formed together with the same material,the electrode of the storage capacitor Cst does not need to be formed ona separate layer, and as a result, the number of masks used during themanufacturing process is decreased. When a unit price of the mask isconsidered, the manufacturing cost is reduced, and the manufacturingtime is shortened.

The first connection part 173 connects the initialization voltage line124, the source electrode 176 d-2 of the second initialization thin filmtransistor T4-2, and the drain electrode 177 g of the bypass thin filmtransistor T7 through the second contact hole 162, the third contacthole 163, and the ninth contact hole 169. As a result, theinitialization voltage Vint is applied to the source electrode 176 d-2of the second initialization thin film transistor T4-2 and the drainelectrode 177 g of the bypass thin film transistor T7. Here, since thefirst and second initialization thin film transistors T4-1 and T4-2 maybe shown as one thin film transistor having a dual gate structure, itmay be understood that the initialization voltage Vint is applied to thesource electrode of the initialization thin film transistor T4.

The second connection part 174 connects the drain electrode 177 c-1 ofthe first compensation thin film transistor T3-1 and the gate electrode125 a of the thin film transistor T1 through the sixth contact hole 166and the seventh contact hole 167. As a result, the voltage of the drainelectrode 177 c-1 of the first compensation thin film transistor T3-1 isapplied to the gate electrode 125 a of the driving thin film transistorT1. A part of the gate electrode 125 a of the driving thin filmtransistor T1 has an exposed region which is not overlapped with theexpanded region of the second driving voltage line 172, and the exposedregion is connected with the drain electrode 177 c-1 of the firstcompensation thin film transistor T3-1 through the second connectionpart 174.

The third connection part 178 is formed on the eighth contact hole 168to be connected with the source electrode 176 f of the emission controlthin film transistor T6. A planarization layer 180 is positioned on thethird connection part 178. In the planarization layer 180, a first uppercontact hole 181 exposing the third connection part 178 and a secondupper contact hole 182 exposing a part of the first driving voltage line192 exist, and the second driving voltage line 172 is exposed by thesecond upper contact hole 182.

The pixel electrode 191 and the first driving voltage line 192 areformed on the planarization layer 180. First, the pixel electrode 191 isconnected with the third connection part 178 through the first uppercontact hole 181 of the planarization layer 180. As a result, the pixelelectrode 191 is connected with the drain electrode 177 f of theemission control thin film transistor T6.

The first driving voltage line 192 is extended in a horizontal directionlike the scan line 121, and has a partially expanded region to easilycontact another wire. The first driving voltage line 192 is electricallyconnected with the second driving voltage line 172 by the second uppercontact hole 182, and the first driving voltage line 192 transfers thedriving voltage ELVDD in a horizontal direction. The first drivingvoltage line 192 overlaps the initialization voltage line 124 on thelayout view in order to reduce an area of the pixel.

An organic emission layer 370 is positioned on the pixel electrode 191,and a common electrode 270 is positioned thereon. The pixel electrode191, the organic emission layer 370, and the common electrode 270configure an organic light emitting diode 70, and the pixel electrode191 is an anode of the organic light emitting diode 70.

The driving thin film transistor T1 is constituted by 125 a, 131 a, 176a, and 177 a, the switching thin film transistor T2 is constituted by125 b, 131 b, 176 b, and 177 b, the compensation thin film transistorsT3-1 and T3-2 are constituted by 125 c-1, 131 c-1, 176 c-1, and 177 c-1,and 125 c-2, 131 c-2, 176 c-2, and 177 c-2, respectively, theinitialization thin film transistors T4-1 and T4-2 are constituted by125 d-1, 131 d-1, 176 d-1, and 177 d-1, and 125 d-2, 131 d-2, 176 d-2,and 177 d-2, respectively, the operation control thin film transistor T5is constituted by 125 e, 131 e, 176 e, and 177 e, the emission controlthin film transistor T6 is constituted by 125 f, 131 f, 176 f, and 177f, and the bypass thin film transistor T7 is constituted by 125 g, 131g, 176 g, and 177 g. Further, the storage capacitor Cst is constitutedby 125 a and 175.

Even in the exemplary embodiment of FIGS. 20 to 22, the organic lightemitting diode display device may be manufactured based on themanufacturing method of the exemplary embodiment of FIGS. 3 to 5.

FIGS. 23 to 28 illustrate layout embodiments of two adjacent pixels inan organic light emitting diode display. Specifically, FIG. 23illustrates two adjacent pixels as a modified example of the pixel inFIG. 3.

Two data lines 171 connected with the two adjacent pixels are adjacentto each other, and two pixels have a line symmetry structure based onany line (hereinafter, referred to as a symmetrical reference line)positioned between the two adjacent data lines 171.

A pixel (hereinafter, referred to as a first pixel) positioned at theleft side of the two pixels illustrated in FIG. 23 has the samestructure as FIG. 3, but there is a difference in that the first drivingvoltage line 126 is extended only in one direction based on the seconddriving voltage line 172. A pixel (a pixel positioned at the right sideof FIG. 23, hereinafter, referred to as a second pixel) positioned inthe extending direction of the first driving voltage line 126 hassymmetry with the first pixel based on the symmetrical reference line.

According to the pixel illustrated in FIG. 23, the driving voltage ELVDDis applied to the second driving voltage line 172 and the first drivingvoltage line 126, and is commonly applied to two pixel columns includingthe two adjacent pixels (the first pixel and the second pixel). In FIG.3, because of the structure in which the first driving voltage line 126is connected with all of the adjacent pixels, there is a difference inthat the driving voltage ELVDD is commonly applied to all of the pixelspositioned in one row. In the exemplary embodiment of FIG. 23, a lineconnecting the second driving voltage line 172 is additionallypositioned at the outside of the display area so as to commonly applythe driving voltage ELVDD to the adjacent second driving voltage lines172.

The exemplary embodiment in FIG. 24 includes two adjacent pixels as amodified example of the pixel of the organic light emitting diodedisplay illustrated in FIG. 12. Even in FIG. 24, like FIG. 23, two datalines 171 connected with the two adjacent pixels are adjacent to eachother, and two pixels have a line symmetry structure based on any line(hereinafter, referred to as a symmetrical reference line) positionedbetween the two adjacent data lines 171.

A pixel (hereinafter, referred to as a first pixel) positioned at theleft side of the two pixels illustrated in FIG. 24 has the samestructure as FIG. 12, but there is a difference in that the firstdriving voltage line 192 is extended only in one direction based on thesecond driving voltage line 172. A pixel (a pixel positioned at theright side of FIG. 24, hereinafter, referred to as a second pixel)positioned in the extending direction of the first driving voltage line192 has symmetry with the first pixel based on the symmetrical referenceline.

According to the pixel illustrated in FIG. 24, the driving voltage ELVDDis applied to the second driving voltage line 172 and the first drivingvoltage line 192, and is commonly applied to two pixel columns includingthe two adjacent pixels (the first pixel and the second pixel). In FIG.12, because of the structure in which the first driving voltage line 192is connected with all of the adjacent pixels, there is a difference inthat the driving voltage ELVDD is commonly applied to all of the pixelspositioned in one row. In the exemplary embodiment of FIG. 24, a lineconnecting the second driving voltage line 172 is additionallypositioned at the outside of the display area so as to commonly applythe driving voltage ELVDD to the adjacent second driving voltage lines172.

In the exemplary embodiment of FIG. 24, unlike the exemplary embodimentof FIG. 23, the first driving voltage line 192 is formed of the samematerial as the pixel electrode 191.

FIG. 25 illustrates an additional embodiment of two adjacent pixels as amodified example of the pixel in FIG. 17. Two data lines 171 connectedwith the two adjacent pixels are adjacent to each other, and the twopixels have a line symmetry structure based on any line (hereinafter,referred to as a symmetrical reference line) positioned between the twoadjacent data lines 171.

A pixel (hereinafter, referred to as a first pixel) positioned at theleft side of the two pixels illustrated in FIG. 25 has the samestructure as FIG. 17, but there is a difference in that the firstdriving voltage line 126 is extended only in one direction based on thesecond driving voltage line 172. A pixel (a pixel positioned at theright side of FIG. 25, hereinafter, referred to as a second pixel)positioned in the extending direction of the first driving voltage line126 has symmetry with the first pixel based on the symmetrical referenceline.

According to the pixel illustrated in FIG. 25, the driving voltage ELVDDis applied to the second driving voltage line 172 and the first drivingvoltage line 126, and is commonly applied to two pixel columns includingthe two adjacent pixels (the first pixel and the second pixel). In FIG.17, because of the structure in which the first driving voltage line 126is connected with all of the adjacent pixels, there is a difference inthat the driving voltage ELVDD is commonly applied to all of the pixelspositioned in one row. In the exemplary embodiment of FIG. 25, a lineconnecting the second driving voltage line 172 is additionallypositioned at the outside of the display area so as to commonly applythe driving voltage ELVDD to the adjacent second driving voltage lines172.

FIG. 26 illustrates another embodiment of two adjacent pixels as amodified example of the organic light emitting diode display in FIG. 20.Even in FIG. 26, like FIG. 25, two data lines 171 connected with the twoadjacent pixels are adjacent to each other, and the two pixels have aline symmetry structure based on any line (hereinafter, referred to as asymmetrical reference line) positioned between the two adjacent datalines 171.

A pixel (hereinafter, referred to as a first pixel) positioned at theleft side of the two pixels illustrated in FIG. 26 has the samestructure as FIG. 20, but there is a difference in that the firstdriving voltage line 192 is extended only in one direction based on thesecond driving voltage line 172. A pixel (a pixel positioned at theright side of FIG. 26, hereinafter, referred to as a second pixel)positioned in the extending direction of the first driving voltage line192 has symmetry with the first pixel based on the symmetrical referenceline.

According to the pixel illustrated in FIG. 26, the driving voltage ELVDDis applied to the second driving voltage line 172 and the first drivingvoltage line 192, and is commonly applied to two pixel columns includingthe two adjacent pixels (the first pixel and the second pixel). In FIG.20, because of the structure in which the first driving voltage line 192is connected with all of the adjacent pixels, there is a difference inthat the driving voltage ELVDD is commonly applied to all of the pixelspositioned in one row. In the exemplary embodiment of FIG. 26, a lineconnecting the second driving voltage line 172 is additionallypositioned at the outside of the display area so as to commonly applythe driving voltage ELVDD to the adjacent second driving voltage lines172.

In the exemplary embodiment of FIG. 26, unlike the exemplary embodimentof FIG. 25, the first driving voltage line 192 is formed of the samematerial as the pixel electrode 191.

FIG. 27 and FIG. 28 respectively illustrate two pixels PX that areadjacent to each other according to an exemplary variation of the pixelof the organic light emitting diode display shown in FIG. 3.Specifically, unlike the two adjacent pixels PX shown in FIG. 23, FIG.27 and FIG. 28 illustrate two adjacent pixels PX located between twoseparated data lines 171.

Each of the pixels in FIG. 27 and FIG. 28 has the same structure of theorganic light emitting diode display shown in FIG. 15. The two adjacentpixels PX have an axis-symmetric structure with respect to a line(referred to as a symmetric reference line) between the two pixels PX.

A pixel of an organic light emitting diode display according to thepresent exemplary embodiment includes a scan line 121, a previous scanline 122, an emission control line 123, and a bypass control line 128respectively receiving a scan signal Sn, a previous scan signal S(n−1),an emission control signal Em, and a bypass signal BP formed along afirst direction Dir1, which is a horizontal direction in a plane view ofFIG. 27 and FIG. 28. A data line 171 crossing the scan line 121, theprevious scan line 122, the emission control line 123, and the bypasscontrol line 128 and applies a data signal Dm to a pixel.

In the organic light emitting diode display according to the presentexemplary embodiment, the initialization voltage line 124 of theprevious exemplary embodiment is omitted, and an initialization voltageline 193 having a structure that is different from that of theabove-described initialization voltage line 124 is further included. Theinitialization voltage line 193 is provided in the same layer as thepixel electrode 191 of the previously described exemplary embodiments,and is separated from the pixel electrode 191. The initializationvoltage line 193, for example, may substantially extend in the firstdirection Dir1 and may be periodically bent.

The organic light emitting diode display according to the presentexemplary embodiment also includes driving voltage lines 126/172/179 happlying a driving voltage ELVDD. The driving voltage lines 126/172/179h include a first driving voltage line 126, a second driving voltageline 172, and a third driving voltage line 179 h.

The first driving voltage line 126 is substantially parallel with thescan line 121.

As shown in FIG. 27 and FIG. 28, the first driving voltage line 126 mayconnect two adjacent second driving voltage lines 172 to each other. Inone embodiment, the first driving voltage line 126 may be extended in ahorizontal direction throughout a plurality of pixels.

The third driving voltage line 179 h extends in the first direction Dir1and may electrically connect two adjacent second driving voltage lines172. The first driving voltage line 126 and the second driving voltageline 172 are electrically connected with each other. The third drivingvoltage line 179 h is electrically connected with the second drivingvoltage line 172 through a fifth contact hole 165 of the interlayerinsulating layer 160.

The third driving voltage line 179 h may further include an expandedportion 179 v expanded or protruded in a second direction Dir2. Theexpanded portion 179 v is substantially provided between two neighboringpixels PX and overlaps at least one of two neighboring data lines 171,interposing an insulating layer therebetween, and may extend along thedata line 171. FIG. 27 and FIG. 28 exemplarily illustrate that theexpanded portion 179 h of the third driving voltage line 179 h overlapsall of the two adjacent data lines 171. The expanded portion 179 vextends along the second direction Dir2 in a plane view and thus crossesthe emission control line 123, and may reach close to a portion wherethe source electrode 176 b of the switching thin film transistor T2 islocated.

The expanded portion 179 v may further include at least one cut-outlocated in a portion, except for the portion overlapping the data line171. For example, the expanded portion 179 v may include a cut-outprovided between two adjacent data lines 171.

When the expanded portion 179 v having conductivity overlaps the dataline 171, the data line 171 is shielded and thus a voltage of anelectric element such as the pixel electrode 191, the driving thin filmtransistor T1, and the like in the periphery area may be prevented frombeing influenced due to signal variation of the data signal Dmtransmitted by the data line 171.

In a cross-sectional view, the second driving voltage line 172 may beprovided in a layer that is different from a layer where the firstdriving voltage line 126 is located and a layer where the third drivingvoltage line 179 h is located. The second driving voltage line 172 andthe first driving voltage line 126 may be provided in the same layer asin the exemplary embodiments illustrated in FIG. 3 to FIG. 5, FIG. 17 toFIG. 19, or FIG. 23. Although the first driving voltage line 126 and thethird driving voltage line 179 h are respectively located in differentlayers, the third driving voltage line 179 h may be provided in the samelayer as the semiconductors 131 of the above-described exemplaryembodiments.

One of the first driving voltage line 126 and the third driving voltageline 179 h connecting two neighboring second driving voltage lines 172may be omitted. FIG. 28 illustrates an exemplary embodiment in which afirst driving voltage line 126 is omitted and the third driving voltageline 179 h connects the second driving voltage lines 172 with each otherin a first direction Dir1.

Referring to FIG. 27 and FIG. 28, together with FIG. 15, one pixel PXincludes a driving thin film transistor T1, a switching thin filmtransistor T2, compensation thin film transistors T3-1 and T3-2,initialization thin film transistors T4-1 and T4-2, an operation controlthin film transistor T5, an emission control thin film transistor T6, abypass thin film transistor T7, a storage capacitor Cst, and an organiclight emitting diode. The structure of the thin film transistorsaccording to the present exemplary embodiment may be the same as orsimilar to the previously described exemplary embodiments (e.g., theexemplary embodiment shown in FIG. 17).

A semiconductor 131 in a pixel PX includes a pair of vertical portionsthat face each other, interposing a semiconductor 131 a of the drivingthin film transistor T1 therebetween. The semiconductor 131 a of thedriving thin film transistor T1 overlaps a gate electrode 125 a. Thesemiconductor 131 a may include, for example, a first extension 31, asecond extension 32, and a bent portion 33.

Most of the left vertical portion of the semiconductor 131 located inthe left-side pixel in FIG. 27 and FIG. 28 do not overlap the data line171, and mostly extends in the second direction Dir2. Further, most ofthe left vertical portion of the semiconductor 131 overlaps the seconddriving voltage line 172.

A source electrode 176 b of the switching thin film transistor T2,connected with an upper portion of a semiconductor 131 b of theswitching thin film transistor T2 which overlaps the scan line 121, isbent toward the left and is electrically connected with the data linethrough a fourth contact hole 164 of the interlayer insulating layer160.

A source electrode 176 e of the operation control thin film transistorT5 is provided below a semiconductor 131 e of the operation control thinfilm transistor T5 overlapping the emission control line 123. The sourceelectrode 176 e is electrically connected with the second drivingvoltage line 172 through a fifth contact hole 165 of the interlayerinsulating layer.

The source electrode 176 e of the operation control thin film transistorT5 is directly connected with the third driving voltage line 197 h inthe same layer. For example, the third driving voltage line 179 h iselectrically connected with the second driving voltage line 172 throughthe fifth contact hole 165 of the interlayer insulating layer 160.

Semiconductors of the compensation thin film transistors T3-1 and T3-2overlapping the scan line 121 and semiconductors of the initializationthin film transistors T4-1 and T4-2 overlapping the previous scan line122 are sequentially formed along an extension direction of thesemiconductor 131 at an upper side of the right vertical portion of thesemiconductor 131 located in the left side pixel PX shown in FIG. 27.

A semiconductor of the emission control thin film transistor T6overlapping the emission control line 123 and a semiconductor of thebypass thin film transistor T7 overlapping the bypass control line 128are sequentially provided along the extension direction of thesemiconductor 131 at a lower side of the right vertical portion of thesemiconductor 131 located in the left side pixel PX shown in FIG. 27.

Source electrodes 176 d-2 of the second initialization thin filmtransistors T4-2 of two adjacent pixels PX are connected with each otherin the same layer. A first connection part 173 overlapping a boundarybetween the two adjacent pixels PX are electrically connected with thesource electrodes 176 d-2 of the second initialization thin filmtransistors T4-2 through a third contact hole 163 of the interlayerinsulating layer. The first connection part 173 is connected with theinitialization voltage line 193 through a third upper contact hole 183of a planarization layer layered on the first connection part 173 andtransmits the initialization voltage Vint to the source electrodes 176d-2.

A drain electrode 177 g of the bypass thin film transistor T7 isconnected with the first connection part 173 through a ninth contacthole 169 of the interlayer insulating layer and thus may receive theinitialization voltage Vint.

The second driving voltage line 172 includes a first portion 172 e thatdoes not overlap the gate electrode 125 a of the driving thin filmtransistor T1 and an expanded region 175 including a part connected withthe first portion 172 e and overlapping the gate electrode 125 a of thedriving thin film transistor T1. The second driving voltage line 172extended throughout the plurality of pixels PX arranged in the seconddirection Dir2 may include the first portions 172 e and the expandedregions 175 that are alternately arranged in the second direction Dir2.

In the left side pixel PX illustrated in FIG. 27 and FIG. 2, the rightedge of the second driving voltage line 172 is bent to the right side atan interface between the first portion 172 e and the expanded region175. Accordingly, the right side of the expanded region 175 overlaps thegate electrode 125 a. A left edge of the second driving voltage line 172may be straight or may be bent at the interface between the firstportion 172 e and the expanded region 175. For example, the width of theexpanded region 175 in the first direction Dir1 is greater than thewidth of the first portion 172 e in the first direction Dir1 so as toassure an overlap area of the second driving voltage line 172 and thegate electrode 125 a of the driving thin film transistor T1.

Referring to FIG. 27 and FIG. 28, the expanded regions 175 in the twoneighboring pixels RX are connected with each other in the same layer.Thus, two adjacent second driving voltage lines 172 may be connectedwith each other through the first driving voltage line 126 or the thirddriving voltage line 179 h, or may be connected through the expandedregions 175 that are connected with each other between the two adjacentpixels PX. Therefore, the plurality of second driving voltage lines 172may be connected to each other throughout the plurality of pixels in thefirst direction Dir1.

Two adjacent second driving voltage lines 172 may be connected with eachother through the expanded regions 175 that are connected with eachother even in a part where the first driving voltage line 126 or thethird driving voltage line 179 h is not formed between the two adjacentpixels PX. Accordingly, a uniform driving voltage ELVDD may betransmitted to the entire pixels PX arranged along the first and seconddirections Dir1 and Dir2.

The expanded region 175 and the gate electrode 125 a of the driving thinfilm transistor T1 form the storage capacitor Cst, with the interlayerinsulating layer 160 therebetween. Since the expanded region 175 has awide width that overlaps the gate electrode 125 a, the storage capacitorCst may have sufficient capacitance compared to the case where theexpanded region 175 is not included. The effect of the sufficientcapacitance may be, for example, the same as previously described.

According to the present exemplary embodiment, only one type ofinterlayer insulating layer 160 may be provided between the expandedregion 175 of the second driving voltage line 172 and the gate electrode125 a of the driving thin film transistor T1. Also, no additionalconductive layer may be provided between a layer where the expandedregion 175 is located and a layer where the gate electrode 125 a of thedriving thin film transistor T1 is located.

Example embodiments have been disclosed herein, and although specificterms are employed, they are used and are to be interpreted in a genericand descriptive sense only and not for purpose of limitation. In someinstances, as would be apparent to one of ordinary skill in the art asof the filing of the present application, features, characteristics,and/or elements described in connection with a particular embodiment maybe used singly or in combination with features, characteristics, and/orelements described in connection with other embodiments unless otherwisespecifically indicated. Accordingly, it will be understood by those ofskill in the art that various changes in form and details may be madewithout departing from the spirit and scope of the present invention asset forth in the following claims.

What is claimed is:
 1. A display device, comprising: a substrate; afirst scan line on the substrate; and a first driving voltage linecrossing the first scan line wherein the first driving voltage lineincludes: a first portion that extends in a first direction and crossesthe first scan line; a second portion that extends in the firstdirection, is separated from the first portion in a second directioncrossing the first direction, and is shorter than the first portion inthe first direction; and a third portion that is disposed between thefirst portion and the second portion connected to the first portion andthe second portion, and shorter than the second portion in the firstdirection.
 2. The device as claimed in claim 1, further comprising: afirst gate electrode disposed on the substrate and separated from thefirst scan line; and a first insulating layer between the first gateelectrode and the first driving voltage line, wherein the third portionof the first driving voltage line overlaps the first gate electrode in aplan view.
 3. The device as claimed in claim 2, further comprising: afirst semiconductor disposed on the substrate, and a second insulatinglayer between the first semiconductor and the first gate electrode,wherein first gate electrode overlaps the first semiconductor in theplan view.
 4. The device as claimed in claim 3, wherein: the firstsemiconductor includes at least one bent portion, and the first drivingvoltage line overlaps the at least one bent portion in the plan view. 5.The device as claimed in claim 3, wherein: a portion of the first gateelectrode is not overlapped by the first driving voltage line, and thefirst insulating layer has a contact hole on the portion of the firstgate electrode.
 6. The device as claimed in claim 5, further comprising:a connector electrically connected to the first gate electrode throughthe contact hole, wherein the connector is in a same layer as the firstdriving voltage line.
 7. The device as claimed in claim 3, furthercomprising: a second semiconductor disposed in a same layer as the firstsemiconductor, wherein the second semiconductor overlaps the first scanline.
 8. The device as claimed in claim 7, wherein: the secondsemiconductor includes a vertical portion extending substantially in thefirst direction, the vertical portion does not overlap the first gateelectrode in the plan view, and the second portion overlaps a gapbetween the first gate electrode and the vertical portion.
 9. The deviceas claimed in claim 7, wherein the first semiconductor and the secondsemiconductor are integrally formed with each other.
 10. The device asclaimed in claim 3, further comprising: a transistor including the firstsemiconductor, the first gate electrode, a first source electrode and afirst drain electrode opposing the first source electrode; and a lightemitting diode electrically connected to the transistor.
 11. The deviceas claimed in claim 1, further comprising: a second driving voltageline, wherein the second driving voltage line and the first drivingvoltage line are arranged in the second direction.
 12. The device asclaimed in claim 11, wherein the first driving voltage line and thesecond driving voltage line are connected to each other.
 13. The deviceas claimed in claim 12, wherein the second driving voltage lineincludes: a fourth portion that extends in the first direction andcrosses the first scan line; a fifth portion that is separated from thefourth portion in the second direction, extends in the first direction,and is shorter than the fourth portion in the first direction; and asixth portion that is disposed between the fourth portion and the fifthportion, connected to the fourth portion and the fifth portion, andshorter than the fifth portion in the first direction.
 14. The device asclaimed in claim 13, wherein the second portion of the first drivingvoltage line is connected to the fifth portion of the second drivingvoltage line in the second direction.
 15. The device as claimed in claim14, wherein a planar shape of the first driving voltage line issymmetrical with a planar shape the second driving voltage line in thesecond direction.
 16. The device as claimed in claim 1, furthercomprising a first data line crossing the first scan line and separatedfrom the first driving voltage line.
 17. The device as claimed in claim16, wherein the first data line is disposed in a same layer as the firstdriving voltage line.
 18. The device as claimed in claim 1, furthercomprising: a third driving voltage line in a different layer from thefirst driving voltage line and electrically connected to the firstdriving voltage line, wherein the third driving voltage line includes aportion substantially extending in the second direction.
 19. The deviceas claimed in claim 18, wherein the third driving voltage line is in adifferent layer from the first driving voltage line.
 20. The device asclaimed in claim 19, wherein the third driving voltage line electricallyconnects two or more adjacent ones of the first driving voltage line toeach other.